Senior Packaging Engineering Leader for Advanced SSDs

Sandisk; George Town; On-site; MYR 120,000 - 180,000; Full time

Job summary

Sandisk in Penang, Malaysia seeks a Senior Staff, Packaging Engineering to drive packaging innovation, quality, and compliance across product lines. You will lead cross-functional teams, advance next‑gen packaging tech, and manage scale-up from pilot to high-volume production.

Ideal candidates bring deep expertise in SMT/PCBA, reliability testing, and data analytics, with a systematic, improvement-focused mindset for a globally distributed manufacturing network.

Qualifications

• Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines.
• Minimum 10 years with Master’s or 8+ years with PhD.
• Proficient understanding of packaging domains including SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout.
• Experience with machine learning and data analytics utilizing AI technologies.

Responsibilities

• Serve as Package Engineering representative on cross-functional leadership teams; ensure packages are fully characterized, qualified, and released to production on schedule.
• Own package lifecycle across design, development, qualification, and manufacturing; align with global factories and stakeholders.
• Lead global engagement with factories/contract manufacturers for high-volume introduction of new package designs and assembly processes.
• Define, develop, and qualify next-generation packaging technologies in line with strategy and roadmaps.
• Drive assembly yield improvement and package cost reduction programs with measurable targets.
• Own package technology roadmaps and budgets; guide scalable packaging infrastructure for growth.

Skills

Packaging

SMT

PCB layout

Data analytics

Communication

Education

Master’s degree or PhD in Materials/Mechanical/Computer Science/Physics

Tools

AI/ML basics

Job description

Sandisk in Penang, Malaysia seeks a Senior Staff, Packaging Engineering to drive packaging innovation, quality, and compliance across product lines. You will lead cross-functional teams, advance next‑gen packaging tech, and manage scale-up from pilot to high-volume production.

Ideal candidates bring deep expertise in SMT/PCBA, reliability testing, and data analytics, with a systematic, improvement-focused mindset for a globally distributed manufacturing network.