Process Development Engineer II: Wire Bond & Yield

ASE SEMICONDUCTOR (PENANG) SDN. BHD.

Penang

On-site

MYR 60,000 - 120,000

Full time

14 days+

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Job summary

Analog Devices, Inc. in Penang, Malaysia, seeks an experienced engineer to develop, set up and operate DA or wire bond processes, and to establish new machine recipes with suitable parameters.

The role includes coordinating DOE evaluations, documenting procedures, and solving process issues with proper analysis tools. The candidate will contribute to yield improvement, work on machine modifications, provide training to engineers, technicians, operators, and trainers, and recommend materials and

Responsibilities

To develop, setup and operate DA or wire bond (Cu/Au) wire process.
To establish new machine recipe with suitable machine and process parameters on DA or wire bonder.
To work on machine modifications/tools/jigs fabrication for yield improvement or enhance Process robustness.
To work on yield improvement.
To coordinate engineering/DOE evaluations build and follow up closely until closure.
To work on documentation such as operating procedures, ROHS, FMEA, control plan etc.
To provide training to all parties such as engineers, technicians, operators, and trainer.
To recommend the best material & process flow for all the new product introduction.
To solve process issues in systematic way by correct analysis tools.

Job description

Analog Devices, Inc. in Penang, Malaysia, seeks an experienced engineer to develop, set up and operate DA or wire bond processes, and to establish new machine recipes with suitable parameters.

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