Senior Package Design Engineer - Advanced IC Packaging

Advanced Micro Devices, Inc.; George Town; On-site; MYR 120,000 - 210,000; Full time

Benefits offered by this job

Competitive benefits

Award-winning culture

Job summary

Advanced Micro Devices, Inc. in Penang, Malaysia, seeks a Senior/Staff Package Design Engineer to own advanced IC package design from concept through tape-out and production, collaborating with SoC, silicon, SI/PI, thermal, and manufacturing teams to meet electrical, mechanical, and cost targets for high-speed interfaces.

You will mentor engineers, define package architecture, and drive design automation, with a focus on LPDDR5X/LPDDR6, PCIe, and die-to-die links, while delivering robust,

Qualifications

• Bachelor’s or Master’s degree in Electrical/Mechanical/Materials Science or related field.
• 5–10 years in IC/package design, preferably in advanced flip-chip or 2.5D/3D packaging.
• Experience with high-speed interfaces and substrate design flows.

Responsibilities

• Execute package substrate design from concept through production release, including floorplanning, routing, stack-up definition, and design rule validation.
• Define and implement package architecture based on product electrical, thermal, and mechanical requirements.
• Collaborate with silicon, system, and board teams to optimize I/O planning and interface signal integrity.
• Drive Design for Manufacturability, Assembly, and Test (DFX) into the package design process.
• Perform modelling extraction for SI/PI and PDN impedance; resolve design issues through layout changes and stack-up tuning.
• Interface with substrate suppliers and contribute to design automation and flow improvements.

Skills

Package design

Signal integrity

Power integrity

High-speed interfaces

Scripting (basic)

Education

Bachelor’s or Master’s in Electrical/Mechanical/Materials Science

Tools

Cadence Sigrity

Ansys HFSS

Q3D

Allegro

Job description

Advanced Micro Devices, Inc. in Penang, Malaysia, seeks a Senior/Staff Package Design Engineer to own advanced IC package design from concept through tape-out and production, collaborating with SoC, silicon, SI/PI, thermal, and manufacturing teams to meet electrical, mechanical, and cost targets for high-speed interfaces.

You will mentor engineers, define package architecture, and drive design automation, with a focus on LPDDR5X/LPDDR6, PCIe, and die-to-die links, while delivering robust,