Chip Packaging Handling Systems Engineer – Robotics & Automation

Intel; Kulim; On-site; MYR 60,000 - 90,000; Full time

Job summary

Intel in Kulim, Malaysia, is seeking a Handling Systems Development Engineer to lead the development and deployment of advanced chip packaging process technology within the MIHL module.

This role focuses on designing handling processes, validating hardware/software upgrades, and delivering reliable solutions for high-volume manufacturing, with a strong emphasis on quality, reliability, and safety.

Qualifications

• Bachelor's or Master's degree in Robotics and Autonomous Systems, Mechanical Engineering, Electrical Engineering or related STEM field.
• 1 year of work experience minimum.
• Experience with motion control, high accuracy/speed robotic systems, and vision systems.
• Fundamental understanding of semiconductor devices and packing technology.

Responsibilities

• Develop handling process recipes and tooling design/validation on the manufacturing floor.
• Test and validate hardware/software upgrades to meet product requirements.
• Develop solutions from platform specification to validation and deployment to high-volume sites.

Skills

Motion control

Vision systems

Robotics

High speed pick-n-place

Education

Robotics/Automation Engineering degree

Tools

CAD

SolidWorks

GD&T

Job description

Intel in Kulim, Malaysia, is seeking a Handling Systems Development Engineer to lead the development and deployment of advanced chip packaging process technology within the MIHL module.

This role focuses on designing handling processes, validating hardware/software upgrades, and delivering reliable solutions for high-volume manufacturing, with a strong emphasis on quality, reliability, and safety.