Lead Principal Engineer - Flip-Chip & Power Packaging

Hana Semiconductor (Ayutthaya) Co., Ltd.

Kuala Lumpur

On-site

MYR 165,000 - 248,000

Full time

12 days ago
Application generator

Turn this role into an interview — a resume and cover letter built around what this employer wants.

Get past ATS filters

Job summary

Hana Semiconductor (Ayutthaya) Co., Ltd. seeks a Principal Engineer (Mgr. Level) to lead new product development in flip-chip technology, power packaging, or SMT.

You will manage an engineering team and coordinate with assembly and test to drive yield and quality improvements, while leading NPI initiatives. The role requires 8+ years of direct experience in flip-chip, power packaging, or SMT, and strong English communication and analytical skills to optimize processes and drive product

Qualifications

  • Bachelor’s degree in Electrical/Electronic or related field.
  • Direct experiences for 8 years up (Flip-chip/Power packaging/SMT).
  • Strong verbal and written English communication skills.
  • Comprehensive knowledge on Semiconductor manufacturing process.
  • Strong reporting skills and statistical analysis.

Responsibilities

  • Manage new product development (Flip-chip technology and/or power packaging or SMT) and integrate process improvement.
  • Lead NPI to ensure development of the technology and products are qualified with high level of quality.
  • Design, execute, analyze experiments and optimize current process to improve yield and performance of the new products.
  • Manage engineering team, coordinate with assembly and test operation to improve yield and quality issues.

Education

Bachelor’s degree in Electrical/Electronic Engineering or related field

Job description

Hana Semiconductor (Ayutthaya) Co., Ltd. seeks a Principal Engineer (Mgr. Level) to lead new product development in flip-chip technology, power packaging, or SMT.

You will manage an engineering team and coordinate with assembly and test to drive yield and quality improvements, while leading NPI initiatives. The role requires 8+ years of direct experience in flip-chip, power packaging, or SMT, and strong English communication and analytical skills to optimize processes and drive product

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Principal Engineer (Mgr. Level )Flip-chip technology or power packaging or SMT
Principal Engineer (Mgr. Level )Flip-chip technology or power packaging or SMT

Hana Semiconductor (Ayutthaya) Co., Ltd. • Kuala Lumpur

On-site
MYR 165,000 - 248,000
Lead Semiconductor Engineering Section Manager
Lead Semiconductor Engineering Section Manager

mnosys sdn bhd • Perak

On-site
MYR 87,000 - 145,000
Airfare for relocation
Temporary accommodation upon arrival
Relocation allowance
Senior Section Manager, Semiconductor Engineering
Senior Section Manager, Semiconductor Engineering

mnosys sdn bhd • Kuala Lumpur

On-site
MYR 132,000 - 158,000
Airfare relocation package
Temporary accommodation on arrival
Relocation allowance (one month’s base
+1
Lead Principal Engineer — Semiconductor Packaging
Lead Principal Engineer — Semiconductor Packaging

Infineon Technologies (Malaysia) Sdn Bhd • Malacca City

On-site
MYR 180,000 - 300,000
Staff Process Engineer
Staff Process Engineer

JAC Recruitment • Penang

On-site
MYR 120,000 - 180,000
Principal Engineer, Semiconductor Packaging & Innovation
Principal Engineer, Semiconductor Packaging & Innovation

Infineon Technologies • Malacca City

On-site
MYR 300,000 - 600,000
Section Manager (Semiconductor Engineering)
Section Manager (Semiconductor Engineering)

mnosys sdn bhd • Kuala Lumpur

On-site
MYR 132,000 - 158,000
Airfare relocation package
Temporary accommodation on arrival
Relocation allowance (one month’s base
+1
Section Manager (Semiconductor Engineering)
Section Manager (Semiconductor Engineering)

mnosys sdn bhd • Perak

On-site
MYR 87,000 - 145,000
Airfare for relocation
Temporary accommodation upon arrival
Relocation allowance
Senior Panel-Level Packaging Engineer & Process Lead
Senior Panel-Level Packaging Engineer & Process Lead

STMicroelectronics Sdn Bhd • Muar

On-site
MYR 180,000 - 300,000
Medical
Education support
Dental
+3
Senior Staff Engineer — Flip Chip Process Development
Senior Staff Engineer — Flip Chip Process Development

Infineon Technologies (Malaysia) Sdn Bhd • Malacca City

On-site
MYR 120,000 - 180,000