Senior Section Manager, Semiconductor Engineering

mnosys sdn bhd; Kuala Lumpur; On-site; MYR 132,000 - 158,000; Full time

Benefits offered by this job

Airfare relocation package

Temporary accommodation on arrival

Relocation allowance (one month’s base

Relocation allowance (one month’s base

Job summary

mnosys sdn bhd is seeking an experienced Section Manager in Semiconductor Engineering to lead a high-performing team, optimize assembly processes, and drive key projects. The role emphasizes Die Attach, Flip Chip, SiP, Wire Bond, and Mold expertise, with a relocation package to Thailand.

The ideal candidate has 7–10+ years in semiconductor engineering, with strong leadership, quality tooling experience (FMEA, SPC, control charts), and PMP preference. Relocation support included.

Qualifications

• Bachelor’s or Master’s Degree in Engineering (Mechatronics, Electrical/Electronic, Materials, Mechanical, or related fields).
• 7–10+ years of progressive engineering experience in semiconductors with leadership history.
• Deep technical command of assembly processes: Die Attach, Flip Chip, SiP, Wire Bond, Mold.
• Demonstrated expertise in FMEA, SPC and Control Charts.
• PMP certification or equivalent is highly preferred.

Responsibilities

• Lead and develop a high-performing engineering team aligned with goals.
• Drive yield and efficiency using Die Attach, Flip Chip, SiP, Wire Bond, Mold know-how.
• Oversee project planning, budgeting, and execution within scope and schedule.
• Implement advanced quality tools across engineering processes.
• Collaborate with Operations and Quality to meet specs and standards.

Skills

Team leadership

Project management

Cross-functional collaboration

Communication

Education

Bachelor’s or Master’s Degree in Engineering

Tools

FMEA

SPC

Control charts

Die Attach

Flip Chip

SiP

Wire Bond

Mold

Job description

mnosys sdn bhd is seeking an experienced Section Manager in Semiconductor Engineering to lead a high-performing team, optimize assembly processes, and drive key projects. The role emphasizes Die Attach, Flip Chip, SiP, Wire Bond, and Mold expertise, with a relocation package to Thailand.

The ideal candidate has 7–10+ years in semiconductor engineering, with strong leadership, quality tooling experience (FMEA, SPC, control charts), and PMP preference. Relocation support included.