Lead Principal Engineer — Semiconductor Packaging

Infineon Technologies (Malaysia) Sdn Bhd; Malacca City; On-site; MYR 180,000 - 300,000; Full time

Job summary

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Lead Principal Engineer in its R&D team in Malaysia to drive packaging definition activities, develop package outlines and drawings, and ensure designs meet electrical, thermal, reliability, and mechanical requirements.

The role requires 7+ years in IC/semiconductor/SMT, strong SMT/packaging knowledge, and proficiency in AutoCAD/3D drafting. Join a global leader driving decarbonization and digitalization through innovative packaging solutions.

Qualifications

• Bachelor’s Degree in Engineering or related field.
• Minimum 7 years of relevant working experience in the IC, semiconductor, or SMT industry.
• Strong knowledge of SMT, semiconductor packaging, assembly and test processes.
• Knowledge of process engineering and equipment engineering principles.
• Knowledge of failure analysis and reliability engineering.
• Strong analytical and problem-solving skills.
• Knowledge of AutoCAD and 3D drafting is preferred.

Responsibilities

• Drive technical definition activities for package projects involving major changes, new package developments, significant risks, or business impacts, including BOM preparation, package design, assembly technology, PRP reviews, and project classification.
• Develop conceptual package outlines and internal construction drawings, finalize and document package designs, and update package drawings as required.
• Define package characteristics to meet electrical, thermal, reliability, and mechanical requirements.
• Coordinate package cost estimation activities (A1-A3) and package cost indication processes (A3).
• Act as the key contact and technical consultant for package definition matters to Business Divisions, particularly in relation to backend assembly technology expertise.
• Support pre-development and project definition activities, and serve as the package design expert throughout the project lifecycle.

Skills

SMT & packaging knowledge

Process engineering principles

Failure analysis & reliability

Analytical & problem solving

AutoCAD & 3D drafting

Education

Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics or Physics)

7+ years in IC/semiconductor/SMT industry

Tools

AutoCAD

3D drafting

Job description

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Lead Principal Engineer in its R&D team in Malaysia to drive packaging definition activities, develop package outlines and drawings, and ensure designs meet electrical, thermal, reliability, and mechanical requirements.

The role requires 7+ years in IC/semiconductor/SMT, strong SMT/packaging knowledge, and proficiency in AutoCAD/3D drafting. Join a global leader driving decarbonization and digitalization through innovative packaging solutions.