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STMicroelectronics Sdn Bhd is seeking an experienced lead for the Panel Level Packaging Assembly Process in Malaysia. You will monitor yield performance in collaboration with process owners and manage carrier plate preparation to ensure quality and controlled circulation.
You will drive process robustness through poka-yoke solutions, preventive actions, and robust systems, while working with Operations, Equipment and Quality to minimize disruptions and support business priorities.
STMicroelectronics Sdn Bhd is seeking an experienced lead for the Panel Level Packaging Assembly Process in Malaysia. You will monitor yield performance in collaboration with process owners and manage carrier plate preparation to ensure quality and controlled circulation.
You will drive process robustness through poka-yoke solutions, preventive actions, and robust systems, while working with Operations, Equipment and Quality to minimize disruptions and support business priorities.