Staff Process Engineer

JAC Recruitment; Penang; On-site; MYR 120,000 - 180,000; Full time

Job summary

JAC Recruitment Malaysia seeks a Staff Process Engineer for a leading global semiconductor organization to drive PQFN packaging and high-volume manufacturing for power devices in Penang.

You will optimize assembly processes, improve yield and cost efficiency, and work with cross-functional teams and external partners to ensure robust production performance. Bachelor’s degree and semiconductor packaging experience required; strong SPC/data analysis skills and project management are essential.

Qualifications

• Bachelor's degree in Mechanical, Materials, Physics, Chemistry, or Applied Sciences.
• Proven semiconductor process engineering or advanced packaging experience.
• Experience with PQFN, QFN, WLCSP or similar package technologies.
• Knowledge of thin wafer handling, die attach and Cu clip assembly.
• Familiar with SPC and data analysis tools (e.g., JMP).
• Strong problem-solving, analytical and project management skills.
• Excellent cross-functional collaboration and communication.

Responsibilities

• Lead package development and process qualification for PQFN and SPS.
• Develop and optimise assembly processes for thin wafer handling, die attach, Cu clip.
• Drive high-volume manufacturing ramp-up and supplier qualification.
• Own sustaining engineering to improve yield, quality, capacity and cost.
• Collaborate with Product, Test, Quality, and Operations to resolve issues.
• Lead root cause analysis and implement corrective actions.
• Manage PLM documentation for accuracy and compliance.
• Drive supplier change management to improve robustness and cost.

Skills

Semiconductor process engineering

SPC / data analysis

Project management

Problem solving

Team collaboration

Communication

Education

Bachelor's degree in Mechanical, Materials, Physics, Chemistry, or Applied Sciences

Tools

JMP

Job description

A leading global semiconductor organization is seeking a Staff Process Engineer to drive advanced packaging development and high-volume manufacturing for power semiconductor products. This role focuses on Power QFN (PQFN) and Cu clip-based thin die assembly processes, supporting both new product introduction and sustaining engineering. You will play a critical role in optimising assembly processes, improving yield and cost efficiency, and ensuring robust production performance while collaborating closely with cross-functional teams and external manufacturing partners.

Key Responsibilities

• Lead package development and process qualification for PQFN (Power Quad Flat No-Lead) packages and Smart Power Stage (SPS) products.
• Develop and optimise assembly processes for thin wafer handling, die attach, and Cu clip technologies.
• Drive high-volume manufacturing ramp-up and qualify new production sources to meet capacity and demand requirements.
• Own sustaining engineering activities, continuously improving yield, quality, capacity, and cost performance.
• Collaborate with Product, Test, Quality, and Operations teams to resolve internal and customer-reported issues.
• Lead root cause analysis and implement corrective and preventive actions for process-related challenges.
• Manage and maintain Product Lifecycle Management (PLM) documentation to ensure accuracy and compliance.
• Drive suppliers change management initiatives to improve manufacturing robustness, scalability, and cost efficiency.
• Apply statistical methods (SPC, data analysis) to monitor performance and drive continuous improvements.

Key Requirements

• Bachelor’s degree in Mechanical, Materials, Physics, Chemistry, or Applied Sciences (or related discipline).
• Proven experience in semiconductor process engineering or advanced packaging development.
• Strong experience with PQFN, QFN, WLCSP, or similar package technologies.
• Knowledge of thin wafer handling, die attach, and Cu clip assembly processes (especially for power devices).
• Understanding of quality and reliability requirements for semiconductor packaging.
• Hands‑on experience with statistical process control (SPC) and data analysis tools (e.g., JMP).
• Strong problem-solving, analytical, and project management skills.
• Effective communication and stakeholder management skills in a cross-functional environment.
• Ability to manage complex projects and drive outcomes in a fast-paced manufacturing environment.