Lead Semiconductor Engineering Section Manager

mnosys sdn bhd; Perak; On-site; MYR 87,000 - 145,000; Full time

Benefits offered by this job

Airfare for relocation

Temporary accommodation upon arrival

Relocation allowance

Job summary

mnosys sdn bhd is seeking an experienced Section Manager (Semiconductor Engineering) to lead engineering teams and optimize advanced assembly processes in a Thailand relocation-friendly role.

The position requires 7–10+ years in semiconductor engineering with deep expertise in Die Attach, Flip Chip, SiP, Wire Bond, and Mold, plus strong project and quality management skills. A relocation package is offered for eligible candidates.

Qualifications

• Bachelor’s or Master’s Degree in Engineering (Mechatronics, Electrical/Electronic, Materials, Mechanical, or related fields).
• 7–10+ years of progressive engineering experience in semiconductors with leadership history.
• Deep technical command of semiconductor assembly processes (Die Attach, Flip Chip, SiP, Wire Bond, Mold).
• Expertise in quality methodology (FMEA, SPC, Control Charts).
• PMI/PMP or equivalent project-management training preferred.

Responsibilities

• Lead and mentor a high-performing engineering team and align with business goals.
• Drive optimization of advanced assembly processes to improve yield and efficiency.
• Oversee project planning, budgeting, and execution within scope and schedule.
• Implement and maintain quality tools across engineering processes.
• Collaborate with Operations and Quality to meet customer specs and regulatory standards.

Skills

Leadership

Team management

Project management

Stakeholder management

Communication

Education

Bachelor’s or Master’s Degree in Engineering

Tools

Die Attach

Flip Chip

SiP

Wire Bond

Mold processes

FMEA

SPC

Control Charts

PMP certification

Job description

mnosys sdn bhd is seeking an experienced Section Manager (Semiconductor Engineering) to lead engineering teams and optimize advanced assembly processes in a Thailand relocation-friendly role.

The position requires 7–10+ years in semiconductor engineering with deep expertise in Die Attach, Flip Chip, SiP, Wire Bond, and Mold, plus strong project and quality management skills. A relocation package is offered for eligible candidates.