Senior Staff Engineer — Flip Chip Process Development

Infineon Technologies (Malaysia) Sdn Bhd; Malacca City; On-site; MYR 120,000 - 180,000; Full time

Job summary

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Senior Staff Engineer in Unit Process Development Flip Chip to lead process development for FOL and Die Attach technologies. You will drive DOE studies, design experiments, and partner with Operations on prototype builds and process validation.

The role requires strong technical leadership, cross-functional collaboration, and hands-on expertise in Flip Chip, Flux Dip, and Reflow, with a focus on quality, cost, and manufacturability.

Qualifications

• Master's or Bachelor's degree in Engineering or related field.
• Minimum 4 years in semiconductor manufacturing or related industry.
• Strong hands-on knowledge of Front-of-Line and Die Attach processes (Flip Chip, Flux Dip, Reflow).
• Proficiency in DOE and statistical analysis tools.
• Excellent communication and cross-functional collaboration skills.
• Knowledge of 8D and Six Sigma is an added advantage.

Responsibilities

• Conduct process development activities to meet project timelines, quality, and cost objectives.
• Develop innovative processes and characterization methodologies and perform risk assessments.
• Support prototype builds and ensure effective knowledge transfer to Operations.
• Prepare and maintain development documentation including Process Specs and FMEA.
• Collaborate with suppliers on tooling/Material verification and qualification.
• Provide technical guidance to project teams for daily activities and deliverables.
• Lead task forces using Root Cause Analysis, 5 Whys, DMAIC, and 8D.

Skills

Engineering degree

Semiconductor industry

FOL & Die Attach

Design of Experiments

Statistical analysis

Communication & teamwork

Education

Master's or Bachelor's Degree in Engineering

Tools

JMP

Minitab

Job description

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Senior Staff Engineer in Unit Process Development Flip Chip to lead process development for FOL and Die Attach technologies. You will drive DOE studies, design experiments, and partner with Operations on prototype builds and process validation.

The role requires strong technical leadership, cross-functional collaboration, and hands-on expertise in Flip Chip, Flux Dip, and Reflow, with a focus on quality, cost, and manufacturability.