Principal Engineer (Mgr. Level )Flip-chip technology or power packaging or SMT

Hana Semiconductor (Ayutthaya) Co., Ltd.; Kuala Lumpur; On-site; MYR 165,000 - 248,000; Full time

Job summary

Hana Semiconductor (Ayutthaya) Co., Ltd. seeks a Principal Engineer (Mgr. Level) to lead new product development in flip-chip technology, power packaging, or SMT.

You will manage an engineering team and coordinate with assembly and test to drive yield and quality improvements, while leading NPI initiatives. The role requires 8+ years of direct experience in flip-chip, power packaging, or SMT, and strong English communication and analytical skills to optimize processes and drive product

Qualifications

• Bachelor’s degree in Electrical/Electronic or related field.
• Direct experiences for 8 years up (Flip-chip/Power packaging/SMT).
• Strong verbal and written English communication skills.
• Comprehensive knowledge on Semiconductor manufacturing process.
• Strong reporting skills and statistical analysis.

Responsibilities

• Manage new product development (Flip-chip technology and/or power packaging or SMT) and integrate process improvement.
• Lead NPI to ensure development of the technology and products are qualified with high level of quality.
• Design, execute, analyze experiments and optimize current process to improve yield and performance of the new products.
• Manage engineering team, coordinate with assembly and test operation to improve yield and quality issues.

Education

Bachelor’s degree in Electrical/Electronic Engineering or related field

Job description

Principal Engineer (Mgr. Level )Flip-chip technology or power packaging or SMT

Principal Engineer ( Manager Level ) for Flip-chip technology or power packaging or SMT

Manage new product development ( Flip-chip technology and/or power packaging/or SMT ) and integrate process improvement.

Lead NPI to ensure development of the technology and products are qualified with high level of quality.

Design, execute ,analyze experiments and optimize current process to improve yield and performance of the new products.

Manage engineering team, coordinate with assembly and test operation to improve yield and quality issues.

Requirements

Working Location in Thailand

Bachelor’s degree in Engineering in Electrical/Electronic or Science or related field

Direct experiences for 8 years up (Flip-chip/Power packaging/SMT)

Comprehensive knowledge on Semiconductor manufacturing process

Strong verbal and written English communication skills.

Strong reporting skills and statistical analysis.