Staff Process Engineer (Semiconductor Packaging - PQFN/QFN, Cu Clip)

Private Advertiser; Bayan Lepas; On-site; MYR 120,000 - 180,000; Full time

Job summary

Private Advertiser in Bayan Lepas, Penang is seeking a Staff Process Engineer to drive development, qualification, and continuous improvement of semiconductor packaging processes, focusing on PQFN/QFN, Cu Clip, and Thin Die technologies.

This role leads process development, manufacturing ramp-up, yield enhancement, and NPI, collaborating with cross-functional teams and external manufacturing partners to ensure robust and cost-effective production.

Qualifications

• Bachelor's degree in engineering or related field.
• Minimum 5 years of semiconductor process/packaging experience.
• Experience with PQFN/QFN, Cu Clip, and thin die handling.
• Proficiency in SPC and statistical analysis tools.

Responsibilities

• Develop, qualify, and optimize semiconductor assembly and packaging processes for PQFN/QFN, Cu Clip, and related package technologies.
• Support package development activities from concept through product qualification and production release.
• Lead manufacturing ramp-up activities and qualify new materials, equipment, and manufacturing sources.
• Drive continuous improvement initiatives to enhance yield, quality, productivity, capacity, and cost performance.
• Perform process characterization, root cause analysis, and corrective actions to resolve manufacturing issues.
• Collaborate with Product Engineering, Test Engineering, Quality, Reliability, Operations, and suppliers to address technical and customer-related concerns.
• Support New Product Introduction (NPI) and product transfers from development to high-volume manufacturing.
• Manage engineering changes and maintain product lifecycle management documentation.
• Apply SPC, DOE, JMP, and other statistical tools to improve process capability and manufacturing performance.
• Work closely with OSAT and contract manufacturing partners to achieve production, quality, and reliability targets.

Skills

Analytical skills

Project management

Communication

Problem solving

Education

Bachelor's degree in engineering or related field

Tools

JMP

Minitab

DOE

Job description

Staff Process Engineer (Semiconductor Packaging - PQFN/QFN, Cu Clip)

Location: Bayan Lepas, Penang | Shah Alam, Selangor | Batu Berendam, Melaka

Job Summary

We are seeking an experienced Staff Process Engineer to drive the development, qualification, and continuous improvement of semiconductor packaging processes, with a focus on PQFN/QFN, Cu Clip, and Thin Die technologies. This role is responsible for process development, manufacturing ramp-up, yield enhancement, and new product introduction (NPI), while working closely with cross-functional teams and external manufacturing partners to ensure robust and cost-effective production.

Key Responsibilities

• Develop, qualify, and optimize semiconductor assembly and packaging processes for PQFN/QFN, Cu Clip, and related package technologies.

• Support package development activities from concept through product qualification and production release.

• Lead manufacturing ramp-up activities and qualify new materials, equipment, and manufacturing sources.

• Drive continuous improvement initiatives to enhance yield, quality, productivity, capacity, and cost performance.

• Perform process characterization, root cause analysis, and corrective actions to resolve manufacturing issues.

• Collaborate with Product Engineering, Test Engineering, Quality, Reliability, Operations, and suppliers to address technical and customer-related concerns.

• Support New Product Introduction (NPI) and product transfers from development to high-volume manufacturing.

• Manage engineering changes and maintain product lifecycle management documentation.

• Apply SPC, DOE, JMP, and other statistical tools to improve process capability and manufacturing performance.

• Work closely with OSAT and contract manufacturing partners to achieve production, quality, and reliability targets.

Requirements

• Bachelor's Degree in Mechanical Engineering, Materials Engineering, Physics, Chemistry, Applied Sciences, or a related discipline.

• Minimum 5 years of relevant experience in semiconductor process engineering, assembly process engineering, packaging engineering, or package development.

• Hands-on experience in one or more of the following areas:

  • PQFN / Power QFN

  • QFN

  • Cu Clip

  • Thin Die Handling

  • Die Attach / Solder Attach

  • Wire Bonding

• Experience in process qualification, yield improvement, process optimization, and manufacturing support within a semiconductor environment.

• Knowledge of semiconductor package quality and reliability requirements.

• Proficiency in SPC and statistical analysis tools such as JMP or Minitab.

• Strong analytical, problem-solving, project management, and communication skills.

• Ability to manage multiple projects and collaborate effectively with global and cross-functional teams.

Preferred Qualifications

• Experience in power semiconductor packaging technologies.

• Experience supporting NPI, product transfer, and high-volume manufacturing.

• Knowledge of package development and qualification methodologies.

• Experience working with OSAT or subcontract manufacturing partners.

• Familiarity with WLCSP and other advanced semiconductor package technologies.