Staff Packaging Engineer

Power Integrations

Bayan Lepas

On-site

MYR 120,000 - 180,000

Full time

14 days+

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Job summary

Power Integrations is seeking a Staff Packaging Engineer based in Penang, Malaysia to lead assembly and NPI improvements at a subcontractor factory. The role focuses on driving yield, quality, delivery, and cost in mass production and to manage new product introductions.

Candidate should have 8+ years in semiconductor assembly/NPI, with hands-on experience in wire bonding or molding, and strong project management skills. English fluency is required.

Qualifications

Bachelor’s degree or above in engineering.
Min 8 years of experience in semiconductor assembly process / NPI engineering or assembly subcon management.
Hand-on experience in wire bonding and/or molding process is very desirable.
Possess a good understanding on assembly process control and requirement.
Strong project management and problem-solving skills.
Fluent in English.
Technically competent, self-motivated, strong commitment and assertive

Responsibilities

To drive improvement on assembly yield, quality, delivery and cost on mass production products.
To manage new product introduction at subcontractor factory.
To support new products, process and package development.
To drive investigation and solution on customer complaint case.
To perform regular process and quality audit at subcontractor site.
Strong interaction with cross functional team on assembly engineering project.

Skills

Project management

Problem-solving

English fluency

Self-motivation

Assertive

Commitment

Education

Bachelor’s degree or above in engineering

Job description

Description

Power Integrations is looking for experience talent with highly motivation as the staff packaging engineer, to manage and to drive improvement on assembly and NPI engineering at subcontractor factory. This role will be based on Penang, Malaysia.

Staff Packaging Engineer

Key Responsibilities

To drive improvement on assembly yield, quality, delivery and cost on mass production products.
To manage new product introduction at subcontractor factory.
To support new products, process and package development.
To drive investigation and solution on customer complaint case.
To perform regular process and quality audit at subcontractor site.
Strong interaction with cross functional team on assembly engineering project.

Qualification

Bachelor’s degree or above in engineering.
Min 8 years of experience in semiconductor assembly process / NPI engineering or assembly subcon management.
Hand-on experience in wire bonding and/or molding process is very desirable.
Possess a good understanding on assembly process control and requirement.
Strong project management and problem-solving skills.
Fluent in English.
Technically competent, self-motivated, strong commitment and assertive