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Intel Corporation in Kulim seeks a Handling Systems Development Engineer to lead development and deployment of advanced chip packaging process technology. You will work on high-accuracy, high-speed pick-n-place systems and material handling solutions for next‑gen semiconductor packaging.
The role emphasizes development and validation of hardware and software to meet stringent quality, reliability, and production requirements on-site in Malaysia.
Intel Corporation in Kulim seeks a Handling Systems Development Engineer to lead development and deployment of advanced chip packaging process technology. You will work on high-accuracy, high-speed pick-n-place systems and material handling solutions for next‑gen semiconductor packaging.
The role emphasizes development and validation of hardware and software to meet stringent quality, reliability, and production requirements on-site in Malaysia.