Module Engineer - Advanced Packaging & Assembly - Kulim

Intel Technology Sdn. Bhd.; Kulim; On-site; MYR 72,000 - 110,000; Full time

Benefits offered by this job

Medical

Miscellaneous allowance

Education support

Dental

Sports

Parking

Vision

Meal subsidy

Daily free fruits

Mother's room

Job summary

Intel Technology Sdn. Bhd. in Kulim seeks a Module Engineer to own and optimize high-volume equipment and processes for advanced packaging and assembly. You will drive performance, yield, and cost improvements while supporting technology transfers and capacity expansion.

The role requires 0–5+ years in semiconductor manufacturing or related fields, strong SPC knowledge, and experience with metrology tools and DOEs. Collaboration with global teams and suppliers is essential for success.

Qualifications

• 0–5+ years of experience in semiconductor manufacturing, assembly, packaging, or equipment engineering.
• SPC knowledge and structured problem-solving methodologies.
• Experience owning, maintaining, and improving equipment.
• Familiar with JMP, SQL, Power BI.
• Capable of working in cleanroom environments.
• Experience in semiconductor assembly and advanced packaging processes.
• Die attach, flip-chip, TCB, Cu pillar/microbump, WLP, or advanced interconnects.
• Experience with metrology and process characterization tools (X-ray, AOI, Warpage, microscopy).
• DOE, FMEA, process characterization and yield improvement methodologies.

Responsibilities

• Own and optimize manufacturing equipment and processes to meet safety, quality, productivity, yield, and cost targets.
• Monitor critical process parameters and analyze data for stability and defect reduction.
• Perform testing, troubleshooting, and root cause investigations using data-driven methods.
• Drive process and equipment improvements to boost manufacturing performance.
• Execute equipment installation, qualification, maintenance, and repair activities.
• Support factory ramps, capacity expansion, and new technology introductions.
• Develop and implement excursion prevention systems and corrective actions.
• Collaborate with global sites for process alignment and tech transfers.
• Work with suppliers and cross-functional teams to improve readiness and capability.
• Support CI initiatives focused on safety, quality, reliability, and excellence.

Skills

SPC knowledge

Data analysis

Troubleshooting

DOE/FMEA

Problem solving

Education

Bachelor's degree in Mechanical/Electrical/Chemical/Materials Engineering

Tools

JMP

SQL

Power BI

Job description

Module Engineer - Advanced Packaging & Assembly - Kulim

Join Intel's Assembly and Test Manufacturing organization as a Module Engineer (Process & Equipment Engineer), where you will own and optimize high-volume manufacturing equipment and processes supporting advanced semiconductor packaging and assembly technologies. In this hands-on role, you will drive equipment performance, yield improvement, process optimization, and manufacturing excellence while supporting factory operations, technology transfers, and capacity expansion initiatives. You will work closely with global manufacturing sites, equipment suppliers, and cross-functional engineering teams to enable the production of next-generation semiconductor products.

Key responsibilities

Own and optimize manufacturing equipment and processes to achieve safety, quality, productivity, yield, and cost targets

Monitor critical process parameters and perform data analysis to maintain process stability and reduce defectivity

Conduct testing, troubleshooting, and root cause investigations using statistical and data-driven methodologies

Drive process and equipment improvements to enhance operational efficiency and manufacturing performance

Execute equipment installation, conversion, qualification, maintenance, and repair activities

Support factory ramps, capacity expansion projects, and new technology introductions

Develop and implement excursion prevention systems and corrective actions

Collaborate with global manufacturing sites to ensure process alignment and successful technology transfers

Work with equipment suppliers and cross-functional teams to improve manufacturing readiness and production capability

Support continuous improvement initiatives focused on safety, quality, reliability, and manufacturing excellence

About you

Bachelor's Degree in Mechanical, Electrical, Chemical, Materials Engineering, or a related engineering discipline

0-5+ years of experience in semiconductor manufacturing, assembly, packaging, equipment engineering, or related industries

Knowledge of statistical process control (SPC) and structured problem-solving methodologies

Experience in equipment ownership, maintenance, troubleshooting, or process improvement

Familiarity with data analysis tools such as JMP, SQL, Power BI, or equivalent software

Ability to work effectively within cleanroom manufacturing environments

Experience in semiconductor assembly and advanced packaging processes

Knowledge of Die Attach, Flip Chip, Thermocompression Bonding (TCB), Cu Pillar / Microbump Technologies, Wafer-Level Packaging, or Advanced Interconnect Technologies

Experience with metrology and process characterization tools including X-Ray Inspection, AOI (Automated Optical Inspection), Warpage Measurement, or Microscopy Analysis

Familiarity with DOE, FMEA, process characterization, and yield improvement methodologies

Intel Corporation (NASDAQ:INTC) expands the boundaries of technology to make the most amazing experiences possible. You may know us for our processors, but we do so much more. From powering the latest devices and the cloud you depend on, to driving policy, diversity, sustainability and education, we create value for our stockholders, customers and society.

Intel Corporation chose Penang, Malaysia as its first offshore location outside of the United States in 1972. Intel’s initial investment in Malaysia has grown significantly since then and as a result, Malaysia’s operations has further expanded to Kulim, Kedah in 1996, becoming one of Intel’s most comprehensive sites.

Intel Corporation (NASDAQ:INTC) expands the boundaries of technology to make the most amazing experiences possible. You may know us for our processors, but we do so much more. From powering the latest devices and the cloud you depend on, to driving policy, diversity, sustainability and education, we create value for our stockholders, customers and society.

Intel Corporation chose Penang, Malaysia as its first offshore location outside of the United States in 1972. Intel’s initial investment in Malaysia has grown significantly since then and as a result, Malaysia’s operations has further expanded to Kulim, Kedah in 1996, becoming one of Intel’s most comprehensive sites.

Perks and benefits Medical Miscellaneous allowance Education support Dental Sports (e.g. Gym) Parking Vision meal subsidy, daily free fruits, mother's room, mo