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Intel in Kulim, Malaysia, is seeking a Handling Systems Development Engineer to lead the development and deployment of advanced chip packaging process technology within the MIHL module.
This role focuses on designing handling processes, validating hardware/software upgrades, and delivering reliable solutions for high-volume manufacturing, with a strong emphasis on quality, reliability, and safety.
Job Description: Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team. The role is located in Kulim as a Handling Systems development engineer leading the development and deployment of Intel's advanced chip packaging process technology.
Experienced Hire
Shift 1 (Malaysia)
Malaysia, Kulim
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
N/A
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.