Assembly Handling Systems Development Engineer

Intel Corporation; Kulim; On-site; MYR 90,000 - 130,000; Full time

Job summary

Intel Corporation in Kulim seeks a Handling Systems Development Engineer to lead development and deployment of advanced chip packaging process technology. You will work on high-accuracy, high-speed pick-n-place systems and material handling solutions for next‑gen semiconductor packaging.

The role emphasizes development and validation of hardware and software to meet stringent quality, reliability, and production requirements on-site in Malaysia.

Qualifications

• Bachelor's or Master's degree in STEM fields related to robotics or engineering.
• At least 1 year of work experience.
• Experience with motion control, high-accuracy/speed robotic systems, and vision systems.

Responsibilities

• Develop handling process recipes, design/validate nozzle tooling and address issues on the manufacturing floor.
• Test and validate hardware/software upgrades to meet product requirements.
• Develop solutions to meet customer requirements from platform specification to validation and deployment at high-volume sites.
• Drive improvements in quality, reliability, cost, yield, process stability, productivity and safety/ergonomics.
• Apply engineering principles to develop novel design solutions for high-volume manufacturing processes.

Skills

Motion control

High-precision robotics

Vision systems

Semiconductor packaging knowledge

Mechanical design

Education

Bachelor's or Master's in Robotics and Autonomous Systems

Bachelor's or Master's in Mechanical Engineering

Bachelor's or Master's in Electrical Engineering

Job description

Job Details

Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team. The role is located in Kulim as a Handling Systems development engineer leading the development and deployment of Intel's advanced chip packaging process technology. In this position, you will be directly responsible for developing material handling technology involving high accuracy and high-speed pick-n-place systems for next generation semiconductor packaging technology.

Responsibilities

• Development of handling process recipes, design/validation of nozzle tooling, and addressing process/equipment issues on the manufacturing floor while delivering to our quality and reliability standards.
• Engaging in testing and validating hardware/software upgrades to meet product requirements.
• Develop solutions to meet customer requirements from platform specification to validation, deployment and proliferation to high volume manufacturing sites.
• Drive improvements in quality, reliability, cost, yield, process stability, productivity and safety/ergonomics.
• Apply fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.

Minimum Qualifications

• Possess a Bachelor's or Master's degree in Robotics and Autonomous Systems, Mechanical Engineering, Electrical Engineering or related STEM field.
• Have at least 1 year of work experience.
• Experience with and fundamental understanding of motion control, high accuracy/speed robotic systems, and vision systems.
• Fundamental understanding of semiconductor devices and packing technology.

Preferred Qualifications

• Proven development & deployment experience in factory automated material handling systems, including Autonomous Mobile Robot (AMR)/Automated Guided Vehicle (AGV), conveyor systems, stockers, automated storage solutions and manufacturing equipment integration.
• Familiarity with advanced autonomous manufacturing concepts (Level 5 & above automation) is preferred.
• Strong kinematics / motion control / vision systems background (High speed / high accuracy pick-n-place, 2D vision systems).
• Mechanical design experience (CAD, Solidwork, GD and T) is preferred.
• Strong understanding of statistical principles, statistical process control (SPC) and Design of Experiments (DOE).
• Ability to apply fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.

Job Type & Working Conditions

Job Type: Experienced Hire Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Kulim Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will require an on-site presence.

Compliance & Hiring Practices

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices.