Die Prep PnP Process Engineer
Intel Corporation
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Job summary
Intel Corporation in Kulim, Malaysia, is seeking a Process and Equipment Engineer specializing in Pick and Place (PnP) to own and optimize high-precision assembly processes within the Die Preparation factory. You will drive yield improvements, streamline troubleshooting, and collaborate with global teams to support next-generation silicon packaging.
The role demands hands-on expertise in PnP processes, DOE, SPC, and RCA, with strong cross-functional communication and the ability to work on-site
Qualifications
- Bachelor/Master degree with at least 2 years of relevant work experience.
- Fresh graduates welcome to apply.
- Experience in semiconductor back-end assembly, Die Preparation and PnP is a plus.
- Good understanding of SPC, data analysis, and structured problem-solving methodologies.
- Strong communication and cross-functional collaboration skills.
Responsibilities
- Own and optimize pick and place process parameters to improve yield.
- Lead troubleshooting and maintenance strategies with tool vendors.
- Analyze data using SPC, DOE, and FMEA to identify root causes.
- Collaborate with upstream/downstream process owners and R&D for NPI.
- Document SOPs and present progress to factory stakeholders.
Skills
Education
Tools
Job description
Intel Corporation in Kulim, Malaysia, is seeking a Process and Equipment Engineer specializing in Pick and Place (PnP) to own and optimize high-precision assembly processes within the Die Preparation factory. You will drive yield improvements, streamline troubleshooting, and collaborate with global teams to support next-generation silicon packaging.
The role demands hands-on expertise in PnP processes, DOE, SPC, and RCA, with strong cross-functional communication and the ability to work on-site
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