High-Speed Robotic Assembly Handling Engineer

Intel Corporation; Kuala Lumpur; On-site; MYR 90,000 - 130,000; Full time

Job summary

Intel Corporation in Kulim, Malaysia, is seeking a Handling Systems Development Engineer to lead the design and deployment of advanced material handling for semiconductor packaging. The role focuses on high-precision pick-and-place hardware and software improvements on the production floor.

The candidate will develop recipes, validate tooling, and drive enhancements in quality, reliability, and productivity while ensuring safety and ergonomic considerations on site.

Qualifications

• Bachelor's or master's degree in robotics/autonomous systems, mechanical or electrical engineering.
• ≥1 year of work experience.
• Experience with motion control, high-accuracy robotic systems, and vision systems.
• Familiarity with semiconductor packaging processes.

Responsibilities

• Develop and deploy material handling systems for high-volume semiconductor packaging.
• Design/validate nozzle tooling and resolve process/equipment issues on the manufacturing floor.
• Test and validate hardware/software upgrades to meet product requirements.
• Improve quality, reliability, cost, yield, and safety in manufacturing processes.

Skills

Motion control

Robotic systems

Vision systems

2D vision

High speed pick-n-place

Kinematics

Education

Bachelor's or Master's in Robotics and Autonomous Systems, Mechanical Engineering, Electrical Engineering or related STEM field

Tools

SolidWorks

GD&T

SPC/DOE concepts

Job description

Intel Corporation in Kulim, Malaysia, is seeking a Handling Systems Development Engineer to lead the design and deployment of advanced material handling for semiconductor packaging. The role focuses on high-precision pick-and-place hardware and software improvements on the production floor.

The candidate will develop recipes, validate tooling, and drive enhancements in quality, reliability, and productivity while ensuring safety and ergonomic considerations on site.