Quality & Reliability Engineer – Semiconductor Packaging

Intel Corporation

Malaysia

Hybrid

MYR 180,000 - 240,000

Full time

47 hours ago
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Benefits offered by this job

Hybrid work model

Job summary

Intel Penang seeks a Manufacturing Quality and Reliability Engineer to support packaging programs from wafer fabrication through assembly. You will drive quality controls, excursion management, and continuous improvement across silicon processing, substrates, and test.

You will collaborate with cross-functional teams to perform root-cause analyses, develop corrective actions, and strengthen early excursion detection and process controls while representing Quality and Reliability in development

Qualifications

  • Master's degree in a relevant field with semiconductor manufacturing experience.
  • Proficiency in statistics and data analytics for quality assessments.
  • Familiarity with QnR Quality Systems and tools.
  • Strong communication and cross-functional collaboration skills.

Responsibilities

  • Assess inline process health, excursion impact, yield risk, and packaging implications.
  • Lead root cause analysis and implement systemic corrective actions using 8D methods.
  • Collaborate with fab, substrates, test, and quality teams to improve controls and detection.
  • Drive SPC, Pareto analysis, control plans, and excursion prevention indicators across manufacturing steps.
  • Support excursion management, MRB, containment, and risk communications with partners and customers.
  • Provide input on thermomechanical interactions to support risk assessment and decisions.
  • Manage material disposition RFCs, monitors, and best known methods.
  • Support technology certification and transfer with development and ramp teams.
  • Use data tools and scripting to flag product, process, or customer risks.

Education

Master's degree in Materials Science, Physics, Chemical Engineering, Mechanical Engineering

Job description

Intel Penang seeks a Manufacturing Quality and Reliability Engineer to support packaging programs from wafer fabrication through assembly. You will drive quality controls, excursion management, and continuous improvement across silicon processing, substrates, and test.

You will collaborate with cross-functional teams to perform root-cause analyses, develop corrective actions, and strengthen early excursion detection and process controls while representing Quality and Reliability in development

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