FOL Process Engineer: Die Attach & Wire Bonding Leader

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 120,000 - 180,000; Full time

Benefits offered by this job

Medical

Education support

Dental

Parking

Car subsidy

Medical for immediate family

Job summary

Carsem (M) Sdn. Bhd is seeking a Senior Engineer to sustain daily production operations and lead continuous improvement in Front of Line Assembly processes, including Die Attach, Flip Chip and Wire Bonding.

You will focus on achieving targets for yield, quality, productivity and cost through engineering solutions and technical leadership. The role requires 3+ years in semiconductor manufacturing, a degree in Engineering, and hands-on experience with RCA, DMAIC and SPC.

Qualifications

• Root cause analysis and problem solving methodologies.
• Experience with 8D and DMAIC methodologies.
• FOL processes exposure such as Die Attach, Flip Chip, or Wire Bonding is advantageous.

Responsibilities

• Provide technical support to ensure smooth production operations.
• Monitor and drive improvements in yield, quality, productivity, and cost.
• Lead continuous improvement projects and process optimization initiatives.
• Develop new processes and evaluate materials or equipment for enhancements.
• Determine standard UPH and ensure capacity for new equipment.
• Review process capability and implement corrective or preventive actions.
• Train and coach technicians; support development of junior staff.
• Perform other duties as required.

Skills

Root Cause Analysis (RCA)

Problem Solving Methodologies

8D Problem Solving

DMAIC

SPC (Statistical Process Control)

FOL/Die Attach/Flip Chip/Wire Bonding

Education

Degree in Engineering or equivalent

Job description

Carsem (M) Sdn. Bhd is seeking a Senior Engineer to sustain daily production operations and lead continuous improvement in Front of Line Assembly processes, including Die Attach, Flip Chip and Wire Bonding.

You will focus on achieving targets for yield, quality, productivity and cost through engineering solutions and technical leadership. The role requires 3+ years in semiconductor manufacturing, a degree in Engineering, and hands-on experience with RCA, DMAIC and SPC.