Lead FOL Process Engineer & Manager - Innovation & Yield

STMicro; Muar; Presencial; MYR 180.000 - 240.000; Jornada completa

Descripción de la vacante

STMicroelectronics Malaysia is seeking a Lead FOL Process Engineer to guide Front-Of-Line assembly processes with expertise in Pre-Assembly, Die Attach, and Wire Bond. You will drive process improvements, ensure quality and yield, and maintain SPC-compliant operations in a high-volume environment.

You will coach engineers, maintain process specifications and control plans, and support NPI transitions. The role requires a Master’s or Bachelor’s in engineering, 7+ years in semiconductor process

Formación

• Bachelor's or Master's degree in engineering field with strong academic record.
• Proven leadership experience in a team setting.
• Experience in semiconductor manufacturing or related field preferred.
• Knowledge of quality tools such as DOE, FMEA, SPC, DMAIC, 8D.
• Strong communication and problem-solving abilities.

Responsabilidades

• Lead the FOL team in driving process improvement initiatives and operational excellence.
• Sustain and improve process performance in quality, yield, and customer concern metrics.
• Support production to achieve targets and improve machine performance and reliability.
• Coach and develop engineers in daily activities and improvement projects.
• Prepare, review, and maintain process specs, SOPs, FMEAs, and control plans.
• Provide technical support for material and process-related quality issues.
• Ensure process compliance and stability within SPC control limits.
• Facilitate knowledge transfer from NPI to production for new products.

Conocimientos

Communication

Analytical

Problem-solving

Leadership

Teamwork

Educación

Master's degree in Mechanical Engineering

Bachelor's degree in Electrical Engineering

Bachelor's degree in Electronics Engineering

Descripción del empleo

STMicroelectronics Malaysia is seeking a Lead FOL Process Engineer to guide Front-Of-Line assembly processes with expertise in Pre-Assembly, Die Attach, and Wire Bond. You will drive process improvements, ensure quality and yield, and maintain SPC-compliant operations in a high-volume environment.

You will coach engineers, maintain process specifications and control plans, and support NPI transitions. The role requires a Master’s or Bachelor’s in engineering, 7+ years in semiconductor process