Lead FOL Process Engineer & Manager - Innovation & Yield

STMicro

Muar

On-site

MYR 180,000 - 240,000

Full time

14 days+
Application generator

Get a reply from this employer — a resume and cover letter tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

STMicroelectronics Malaysia is seeking a Lead FOL Process Engineer to guide Front-Of-Line assembly processes with expertise in Pre-Assembly, Die Attach, and Wire Bond. You will drive process improvements, ensure quality and yield, and maintain SPC-compliant operations in a high-volume environment.

You will coach engineers, maintain process specifications and control plans, and support NPI transitions. The role requires a Master’s or Bachelor’s in engineering, 7+ years in semiconductor process

Qualifications

  • Bachelor's or Master's degree in engineering field with strong academic record.
  • Proven leadership experience in a team setting.
  • Experience in semiconductor manufacturing or related field preferred.
  • Knowledge of quality tools such as DOE, FMEA, SPC, DMAIC, 8D.
  • Strong communication and problem-solving abilities.

Responsibilities

  • Lead the FOL team in driving process improvement initiatives and operational excellence.
  • Sustain and improve process performance in quality, yield, and customer concern metrics.
  • Support production to achieve targets and improve machine performance and reliability.
  • Coach and develop engineers in daily activities and improvement projects.
  • Prepare, review, and maintain process specs, SOPs, FMEAs, and control plans.
  • Provide technical support for material and process-related quality issues.
  • Ensure process compliance and stability within SPC control limits.
  • Facilitate knowledge transfer from NPI to production for new products.

Skills

Communication
Analytical
Problem-solving
Leadership
Teamwork

Education

Master's degree in Mechanical Engineering
Bachelor's degree in Electrical Engineering
Bachelor's degree in Electronics Engineering

Job description

STMicroelectronics Malaysia is seeking a Lead FOL Process Engineer to guide Front-Of-Line assembly processes with expertise in Pre-Assembly, Die Attach, and Wire Bond. You will drive process improvements, ensure quality and yield, and maintain SPC-compliant operations in a high-volume environment.

You will coach engineers, maintain process specifications and control plans, and support NPI transitions. The role requires a Master’s or Bachelor’s in engineering, 7+ years in semiconductor process

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

FOL Process Engineering Lead - Drive Excellence
FOL Process Engineering Lead - Drive Excellence

STMicroelectronics • Muar

On-site
MYR 180,000 - 260,000
Leadframe Process & Tooling Expert — Yield & NPI Leader
Leadframe Process & Tooling Expert — Yield & NPI Leader

STMicroelectronics • Muar

On-site
MYR 150,000 - 190,000
Leadframe Process & Tooling Engineer — Drive Yield
Leadframe Process & Tooling Engineer — Drive Yield

STMicroelectronics Sdn Bhd • Muar

On-site
MYR 120,000 - 170,000
Medical education support
Dental
Sports (e.g. Gym)
+3
FOL Process Engineering Lead / Manager – Pre-Assembly, Die Attach & Wire Bond
FOL Process Engineering Lead / Manager – Pre-Assembly, Die Attach & Wire Bond

STMicro • Muar

On-site
MYR 180,000 - 240,000
Senior Leadframe Process & Tooling Specialist
Senior Leadframe Process & Tooling Specialist

ST • Muar

On-site
MYR 150,000 - 190,000
Senior Staff Engineer - Die Bond Process Excellence
Senior Staff Engineer - Die Bond Process Excellence

Infineon Technologies AG • Malacca City

On-site
MYR 180,000 - 300,000
Plating Process Engineer: Yield & Process Innovation
Plating Process Engineer: Yield & Process Innovation

STMicro • Muar

On-site
MYR 90,000 - 130,000
Unit Process Engineer - Semiconductor Yield & Quality
Unit Process Engineer - Semiconductor Yield & Quality

Infineon Technologies AG • Malacca City

On-site
MYR 89,000 - 134,000
Lead Process Integration Engineer: Yield & Quality
Lead Process Integration Engineer: Yield & Quality

Infineon Technologies • Kulim

On-site
MYR 90,000 - 150,000
FOL Process Engineering Lead / Manager – Pre-Assembly, Die Attach & Wire Bond
FOL Process Engineering Lead / Manager – Pre-Assembly, Die Attach & Wire Bond

STMicroelectronics • Muar

On-site
MYR 180,000 - 260,000