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STMicroelectronics Malaysia is seeking a Lead FOL Process Engineer to guide Front-Of-Line assembly processes with expertise in Pre-Assembly, Die Attach, and Wire Bond. You will drive process improvements, ensure quality and yield, and maintain SPC-compliant operations in a high-volume environment.
You will coach engineers, maintain process specifications and control plans, and support NPI transitions. The role requires a Master’s or Bachelor’s in engineering, 7+ years in semiconductor process
STMicroelectronics Malaysia is seeking a Lead FOL Process Engineer to guide Front-Of-Line assembly processes with expertise in Pre-Assembly, Die Attach, and Wire Bond. You will drive process improvements, ensure quality and yield, and maintain SPC-compliant operations in a high-volume environment.
You will coach engineers, maintain process specifications and control plans, and support NPI transitions. The role requires a Master’s or Bachelor’s in engineering, 7+ years in semiconductor process