Die Bond & Wire Bond Process Owner Engineer

Nexperia; Seremban; On-site; MYR 72,000 - 108,000; Full time

Job summary

Nexperia in Malaysia seeks a hands-on Process Engineer to own Die Attach and Wire Bond operations on a high-volume R2R line. You will ensure stable uptime, yield improvements, and compliance with specs while supporting NPI and material changes.

You will analyze data with Excel, Spotfire, and Power BI, lead DOE, FMEA, and root-cause analyses, and train technicians. A Bachelor's in engineering and 2–3 years in Die Bond/Wire Bond is required.

Qualifications

• Bachelor's degree in engineering or related field.
• 2–3 years hands-on Die Bond and/or Wire Bond process experience in semiconductor backend manufacturing.
• Strong knowledge of R2R assembly lines and high-volume production environments.
• Hands-on experience in equipment setup, calibration, troubleshooting, and optimization.
• Knowledge of DOE, FMEA, SPC, 8D, and structured problem-solving methods.
• Ability to analyze manufacturing data using Excel, Spotfire, Power BI, or similar tools.

Responsibilities

• Own and sustain Die Attach and Wire Bond processes and equipment, ensuring stable operation and compliance with specifications.
• Manage tooling setup, calibration, alignment, and qualification activities.
• Provide daily process and equipment support to production lines for smooth operations.
• Conduct DOE, FMEA, and root cause analysis to resolve yield and quality issues.
• Optimize bonding parameters and validate process capability (Cpk) for new/existing products.
• Lead NPI setups, conversions, and buy-offs for new products/material changes.
• Analyze equipment performance and process data (UPH, yield, downtime, alarms) using Spotfire/Power BI/Excel.
• Drive continuous improvement and cost-reduction projects to boost productivity and reduce scrap.
• Implement digital controls and interlocks to prevent human/equipment errors.
• Collaborate with QA, Production, Engineering, and Design teams for reliability and compliance.
• Document procedures, SOPs, setup guides, and troubleshooting standards.
• Provide technical training and mentoring to technicians/operators.
• Prepare and present weekly reports on yield and performance.

Skills

Problem solving

Data analysis

Cross-functional teamwork

Attention to detail

Communication

Education

Bachelor's degree in engineering

Tools

Spotfire

Power BI

Excel

Job description

Nexperia in Malaysia seeks a hands-on Process Engineer to own Die Attach and Wire Bond operations on a high-volume R2R line. You will ensure stable uptime, yield improvements, and compliance with specs while supporting NPI and material changes.

You will analyze data with Excel, Spotfire, and Power BI, lead DOE, FMEA, and root-cause analyses, and train technicians. A Bachelor's in engineering and 2–3 years in Die Bond/Wire Bond is required.