Die Bond Process Technician — Precision & Impact

NXP Semiconductors; Kuala Lumpur; On-site; MYR 38,000 - 66,000; Full time

Job summary

NXP Semiconductors in Malaysia is seeking a Diploma-qualified engineer to perform die bond process tasks on quality hold material. You will work closely with equipment and manufacturing teams to optimize DB processes and techniques.

You will help resolve DB-related issues to minimize production downtime, apply attention to detail and troubleshooting skills, and contribute to a safe, efficient production environment.

Qualifications

• Diploma or above in Engineering or a related field.
• Working experience with DB process is preferable and recommended.
• Strong attention to detail and technical troubleshooting skills.

Responsibilities

• Perform die bond process task on quality hold material.
• Collaborate with equipment & manufacturing team to improve DB processes and techniques.
• Assist in resolving DB-related issues to minimize production downtime.

Skills

Attention to detail

Troubleshooting

Team collaboration

Education

Diploma or above in Engineering

Job description

NXP Semiconductors in Malaysia is seeking a Diploma-qualified engineer to perform die bond process tasks on quality hold material. You will work closely with equipment and manufacturing teams to optimize DB processes and techniques.

You will help resolve DB-related issues to minimize production downtime, apply attention to detail and troubleshooting skills, and contribute to a safe, efficient production environment.