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Nexperia is seeking a hands-on engineer to own end-to-end Die Bond and Wire Bond processes on an R2R semiconductor assembly line in Malaysia. The role emphasizes maintaining high equipment uptime, process stability, yield improvement, and quality excellence in a high-volume environment.
You will collaborate across QA, Production, Engineering and Design, drive continuous improvement, and implement robust controls to prevent process and equipment-related failures.
Nexperia is seeking a hands-on engineer to own end-to-end Die Bond and Wire Bond processes on an R2R semiconductor assembly line in Malaysia. The role emphasizes maintaining high equipment uptime, process stability, yield improvement, and quality excellence in a high-volume environment.
You will collaborate across QA, Production, Engineering and Design, drive continuous improvement, and implement robust controls to prevent process and equipment-related failures.