Wire Bond Process & Equipment Senior/Staff Engineer

Nexperia; Seremban; On-site; MYR 120,000 - 180,000; Full time

Job summary

Nexperia in Malaysia seeks a Senior/Staff Wire Bond Equipment & Process Engineer to optimize semiconductor manufacturing with a strong focus on wire bonding, process improvements, and reliability.

You will lead equipment setup, process qualification, and data-driven improvements while mentoring junior engineers and ensuring safety and quality standards.

Qualifications

• Bachelor's degree in Electrical/Electronic Engineering or related field.
• 5–8 years of experience in wire bonding equipment and semiconductor process engineering.
• Strong knowledge of thermosonic and ultrasonic wire bonding for Gold and Copper.
• Hands-on ASM wire bonders, bonder programming, and process optimization.

Responsibilities

• Lead setup, qualification, and optimization of wire bonding equipment and processes.
• Drive continuous improvements to yield, reliability, and throughput.
• Troubleshoot equipment and process issues in high-volume manufacturing.
• Develop and maintain FMEA, Control Plans, OCAP, and SPC documentation.
• Support audits and cost-reduction/MVA improvement projects.
• Mentor junior engineers and promote knowledge sharing.

Skills

Analytical thinking

Problem-solving

Communication

Team collaboration

Education

Bachelor's degree in Electrical/Electronic, Mechanical Engineering, or Materials Science

Tools

ASM wire bonders

Bonder programming

JMP

Minitab

Job description

About the Role

We are seeking a Senior/Staff Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.

What You Will Do

• Lead the setup, qualification, and optimization of wire bonding equipment and processes (including CZ and DOE activities).
• Drive continuous process improvements to enhance yield, reliability, and throughput.
• Troubleshoot and resolve equipment and process-related issues in a high-volume manufacturing environment.
• Perform disposition of non-conforming materials and implement corrective/preventive actions.
• Collaborate with design, quality, and manufacturing teams to support new product introductions (NPI).
• Analyze process data, identify trends, and implement data-driven improvements.
• Mentor and guide junior engineers; promote knowledge sharing and best practices.
• Ensure compliance with safety, quality, and environmental standards.
• Develop and maintain documentation such as FMEA, Control Plans, OCAP, and SPC.
• Support internal and external audits.
• Lead cost reduction and MVA (Manufacturing Value Add) improvement projects.
• Perform additional tasks as assigned by management.

What You Will Need

• Bachelor’s degree in Electrical/Electronic Engineering, Mechanical Engineering, Materials Science, or a related field.
• Minimum 5-8 years of experience in wire bonding equipment and semiconductor process engineering.
• Strong understanding of thermosonic and ultrasonic wire bonding techniques for Gold and Copper. Others wire type handling is a plus.
• Solid Hands-on experience in ASM wire bonders, bonder programming, and process optimization.
• KNS Hands-on experience is a plus.
• Solid analytical and problem-solving skills, with experience using data to drive decisions.
• Knowledge of semiconductor manufacturing standards, quality control, and reliability testing.
• Statistical Knowledge/Hands-on in JMP, Minitab and/or other statistical tools.
• Excellent communication and collaboration skills; ability to work across teams.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality.

At our core is an 12,000+ strong international network with a singular focus.

Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face.

We support, reward and challenge individuals equally, in a dynamic and energetic environment.