Wire Bond Process Engineer: Yield & Quality Optimizer

ASE Electronics Malaysia

Bayan Lepas

On-site

MYR 60,000 - 90,000

Full time

4 days ago
Be an early applicant

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Annual Leave
Medical and Hospitalisation Leave
EPF
SOCSO
Annual Bonus
Medical Insurance

Job summary

ASE Electronics Malaysia is seeking a Wire Bond Engineer to design, develop and optimize wire bond processes for high-yield manufacturing. The role focuses on delivering quality while meeting delivery goals, with close collaboration across production, QA and engineering teams.

The candidate should have a degree in Electronics or Electrical Engineering and Mechanical discipline, plus solid knowledge of electronics/semi conductors and quality tools.

Qualifications

  • Must have degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Solid knowledge of electronics/semiconductors and related quality tools (SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan).
  • Experience with working instructions and predictive maintenance is a plus.

Responsibilities

  • Develop, design, and optimize processes in manufacturing to achieve delivery goals and quality.
  • Monitor and evaluate processes; provide disposition for product and process issues.
  • Investigate failures, assess damage, and determine implications for process handling materials defects or equipment trouble.
  • Support on-line troubleshooting and line technical issues; liaise with production, QA and support groups.

Skills

Basic technical knowledge in Electron­
Familiar with SPC FMEA DOE TPM OCAP JP

Education

Degree in Electronics/Electrical Engineering and Mechanical or equivalent

Job description

ASE Electronics Malaysia is seeking a Wire Bond Engineer to design, develop and optimize wire bond processes for high-yield manufacturing. The role focuses on delivering quality while meeting delivery goals, with close collaboration across production, QA and engineering teams.

The candidate should have a degree in Electronics or Electrical Engineering and Mechanical discipline, plus solid knowledge of electronics/semi conductors and quality tools.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Semiconductor Process Engineer: Boost Yield & Quality
Semiconductor Process Engineer: Boost Yield & Quality

ASE Electronics Malaysia • Bayan Lepas

On-site
MYR 60,000 - 90,000
Annual Leave
Medical Insurance
EPF
+2
Wire Bond Process Engineer: Yield & SPC Optimization
Wire Bond Process Engineer: Yield & SPC Optimization

Fairwork • Ipoh

On-site
Senior Wire Bond Process Engineer-Drive Yield & Innovation
Senior Wire Bond Process Engineer-Drive Yield & Innovation

Nexperia • Seremban

On-site
MYR 180,000 - 300,000
Wire Bond Process Engineer: Yield & Quality Accelerator
Wire Bond Process Engineer: Yield & Quality Accelerator

ASE Electronics Malaysia • Bayan Lepas

On-site
MYR 60,000 - 90,000
Annual Leave
Medical and Hospitalisation Leave
EPF
+3
Wire Bond Process Engineer: Yield & Quality Innovator
Wire Bond Process Engineer: Yield & Quality Innovator

Carsem • Ipoh

On-site
MYR 78,000 - 112,000
Senior Wire Bond Process Engineer - Quality & Innovation
Senior Wire Bond Process Engineer - Quality & Innovation

Carsem • Ipoh

On-site
MYR 60,000 - 90,000
Die Attach & Wire Bond Process Engineer
Die Attach & Wire Bond Process Engineer

Nexperia • Seremban

On-site
MYR 80,000 - 120,000
Senior Wire Bond Process Sustaining Engineer - Yield Focus
Senior Wire Bond Process Sustaining Engineer - Yield Focus

Nexperia • Seremban

On-site
MYR 180,000 - 240,000
Wire Bond Process Senior Engineer
Wire Bond Process Senior Engineer

Carsem • Ipoh

On-site
MYR 60,000 - 90,000
AI-Driven Wire Bond Process Engineer
AI-Driven Wire Bond Process Engineer

Carsem • Ipoh

On-site
MYR 60,000 - 90,000