Wire Bond Process Technician - Optimize, Qualify & Troubleshoot

NXP Semiconductors; Kuala Lumpur; On-site; MYR 30,000 - 36,000; Full time

Job summary

NXP Semiconductors is seeking a technician to perform machine setup, conversion, and qualification for wire bond equipment in Malaysia. You will monitor daily production performance and ensure compliance with process specifications to support output, quality, and delivery targets.

The role includes performing process verification before production release, analyzing process data for trends, and assisting engineers with root-cause analysis to improve yield and reliability.

Responsibilities

• Perform machine setup, conversion, and qualification for wire bond equipment.
• Monitor daily production performance and ensure compliance with process specifications.
• Support production to achieve output, quality, and delivery targets.
• Analyze process data, troubleshoot wire bond defects, and support root cause analysis.

Job description

NXP Semiconductors is seeking a technician to perform machine setup, conversion, and qualification for wire bond equipment in Malaysia. You will monitor daily production performance and ensure compliance with process specifications to support output, quality, and delivery targets.

The role includes performing process verification before production release, analyzing process data for trends, and assisting engineers with root-cause analysis to improve yield and reliability.