Die Bond Process Engineer: Optimize Yields & NPI

NXP Semiconductors

Kuala Lumpur

On-site

MYR 120,000 - 180,000

Full time

6 days ago

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Job summary

NXP Semiconductors in Malaysia is seeking an Assembly Die Bond Engineer to develop, optimize, and sustain die bonding processes for semiconductor packages, with a focus on quality, yield, and cycle-time reduction. You will provide daily engineering support, troubleshoot die bond issues, analyze yield losses, and drive CAPA and continuous improvement using Lean and Six Sigma methodologies.

Qualification: Bachelor/Master in related engineering with semiconductor die bond experience; document

Qualifications

Bachelor’s or Master’s degree in a related engineering field with semiconductor or die bonding experience.
Experience developing, qualifying, and sustaining die bonding processes.
Strong problem solving and analytical skills; capable of root cause analysis.
Familiarity with Lean Manufacturing and Six Sigma methodologies.

Responsibilities

Develop, qualify, and optimize die bonding processes for semiconductor packages.
Establish process parameters and operating specifications; support new package development and transfers.
Provide daily engineering support to manufacturing operations and troubleshoot die bond issues.
Analyze yield losses and process excursions; implement CAPA and continuous improvement actions.
Monitor process capability (Cp/Cpk) and ensure compliance with quality standards.