Die Attach & Wire Bond Engineer – Lead Yields & Innovation

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 72,000 - 90,000; Full time

Benefits offered by this job

Medical

Education support

Dental

Parking

Medical for immediate family members

Car subsidy

Job summary

Carsem (M) Sdn. Bhd in Ipoh, Malaysia is seeking a Die Attach & Wire Bond Process Engineer to join our manufacturing team.

The role focuses on developing and sustaining processes that enhance quality, efficiency and innovation in our semiconductor packaging operations. The ideal candidate will have a Bachelor’s Degree in Engineering and at least 2 years of relevant experience, with proficiency in JMP for DOE, and strong Excel and PowerPoint skills for data presentation.

Qualifications

• Bachelor’s Degree in Engineering or a related field.
• Minimum of 2 years of relevant working experience in a similar role.

Responsibilities

• Train, motivate and supervise a team of engineers or process technicians or engineering operators to achieve process yields, quality and productivity through proper teamwork.
• Provide technical support and solution to process issues.
• Develop and monitor yield, quality, and involve productivity improvement and cost reduction programs and also E/Q lots.
• Develop new process and source for materials, equipment for continuous breakthrough improvement.
• Review and ensure customer specification is complied.
• Develop/improve process flow and update specifications to reflect changes in production by customers or in-house products.
• Determine standard UPH, standard operation procedure and material for new equipment/process.
• Quality accountability such as VOC/VOP/MRB/CAPA improvement and update specification to reflect control and customer audit failure

Skills

JMP DOE analysis

Excel

PowerPoint

Education

Bachelor's degree in Engineering

Job description

Carsem (M) Sdn. Bhd in Ipoh, Malaysia is seeking a Die Attach & Wire Bond Process Engineer to join our manufacturing team.

The role focuses on developing and sustaining processes that enhance quality, efficiency and innovation in our semiconductor packaging operations. The ideal candidate will have a Bachelor’s Degree in Engineering and at least 2 years of relevant experience, with proficiency in JMP for DOE, and strong Excel and PowerPoint skills for data presentation.