Wire Bond Process Engineer: Yield & Process Excellence

Carsem; Ipoh; On-site; MYR 60,000 - 90,000; Full time

Job summary

Jora Malaysia is seeking a Wire Bond Process Engineer to monitor bonding yield, analyze defects, and drive improvements in wedge/wire bonding processes. You'll develop robust recipes and lead cross-functional teams to meet customer specs and internal targets.

The role requires a Bachelor’s degree in Engineering and hands-on experience in semiconductor assembly, with strong problem-solving and data analysis skills, plus excellent communication for customer interactions.

Qualifications

• Bachelor's degree in Engineering with relevant disciplines.
• Experience in semiconductor assembly, specifically wedge bonding or wire bonding processes.
• Strong knowledge of statistical analysis and problem-solving tools (SPC, DOE, FMEA).
• Familiarity with bonding equipment and materials (Al wire, substrates, etc.).
• Good communication skills for customer interaction and reporting.

Responsibilities

• Monitor and analyze bonding yield; identify root causes of defects and yield loss.
• Lead yield improvement activities using structured problem-solving methods (8D, FMEA, DOE).
• Establish and maintain process control parameters; ensure production compliance.
• Drive continuous yield improvements to meet internal targets and customer expectations.
• Develop and optimize bonding recipes (force, ultrasonic power, time, temperature).
• Improve process stability against material and environmental variations.
• Conduct DOE to validate changes; implement standardization and best practices.
• Manage tooling life, replacement frequency, and collaborate with maintenance.
• Provide technical interface; respond to customer inquiries; participate in audits.
• Maintain documentation; prepare yield reports and improvement updates.
• Lead cross-functional collaboration; train operators; support cost-reduction initiatives; ensure 5S.

Skills

Statistical analysis

Problem-solving

Communication skills

Semiconductor assembly experience

Wedge bonding / Wire bonding

Education

Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, or related field)

Tools

Bonding equipment knowledge

Al wire materials

Job description

Jora Malaysia is seeking a Wire Bond Process Engineer to monitor bonding yield, analyze defects, and drive improvements in wedge/wire bonding processes. You'll develop robust recipes and lead cross-functional teams to meet customer specs and internal targets.

The role requires a Bachelor’s degree in Engineering and hands-on experience in semiconductor assembly, with strong problem-solving and data analysis skills, plus excellent communication for customer interactions.