Wire Bond Process Engineer: Yield & Quality Optimizer

ASE Electronics Malaysia; Bayan Lepas; On-site; MYR 40,000 - 54,000; Full time

Job summary

Jora Malaysia is seeking a Wire Bond Process & Equipment Engineer, open to fresh graduates, to design, develop, and optimize semiconductor packaging processes to meet delivery and quality targets.

The role involves evaluating processes to improve yield, quality and productivity, troubleshooting on-line equipment, training floor members, and driving cost-reduction initiatives while liaising with production, QA and customers about yield and process issues.

Qualifications

• Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
• Basic technical knowledge in Electronics/Semiconductors.

Responsibilities

• Develop, formulate, evaluate and execute process engineering to improve yield, quality, productivity and cost.
• Monitor, verify analysis and provide disposition to process-related concerns.
• Characterize failures and determine implications on process handling materials or machine trouble.
• Follow up ongoing evaluations and handle on-the-line technical trouble.
• Train floor members and prepare process instructions.
• Review process requirements and customer specifications.
• Drive cost reduction and second source programs.
• Liaise with production, QA and support groups on related problems.

Education

Degree in Electronics/Electrical Engineering and Mechanical or equivalent

Job description

Jora Malaysia is seeking a Wire Bond Process & Equipment Engineer, open to fresh graduates, to design, develop, and optimize semiconductor packaging processes to meet delivery and quality targets.

The role involves evaluating processes to improve yield, quality and productivity, troubleshooting on-line equipment, training floor members, and driving cost-reduction initiatives while liaising with production, QA and customers about yield and process issues.