Wire Bond Process Engineer | Semiconductor Assembly

Carsem; Ipoh; On-site; MYR 60,000 - 90,000; Full time

Job summary

Jora Malaysia is seeking a Wire Bond Process Engineer to monitor bonding yield, analyze defects, and drive improvements in wedge/wire bonding processes. You'll develop robust recipes and lead cross-functional teams to meet customer specs and internal targets.

The role requires a Bachelor’s degree in Engineering and hands-on experience in semiconductor assembly, with strong problem-solving and data analysis skills, plus excellent communication for customer interactions.

Qualifications

• Bachelor's degree in Engineering with relevant disciplines.
• Experience in semiconductor assembly, specifically wedge bonding or wire bonding processes.
• Strong knowledge of statistical analysis and problem-solving tools (SPC, DOE, FMEA).
• Familiarity with bonding equipment and materials (Al wire, substrates, etc.).
• Good communication skills for customer interaction and reporting.

Responsibilities

• Monitor and analyze bonding yield; identify root causes of defects and yield loss.
• Lead yield improvement activities using structured problem-solving methods (8D, FMEA, DOE).
• Establish and maintain process control parameters; ensure production compliance.
• Drive continuous yield improvements to meet internal targets and customer expectations.
• Develop and optimize bonding recipes (force, ultrasonic power, time, temperature).
• Improve process stability against material and environmental variations.
• Conduct DOE to validate changes; implement standardization and best practices.
• Manage tooling life, replacement frequency, and collaborate with maintenance.
• Provide technical interface; respond to customer inquiries; participate in audits.
• Maintain documentation; prepare yield reports and improvement updates.
• Lead cross-functional collaboration; train operators; support cost-reduction initiatives; ensure 5S.

Skills

Statistical analysis

Problem-solving

Communication skills

Semiconductor assembly experience

Wedge bonding / Wire bonding

Education

Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, or related field)

Tools

Bonding equipment knowledge

Al wire materials

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Wire Bond Process Engineer | Semiconductor Assembly

Monitor and analyze bonding yield, identifying root causes of defects and yield loss.

Lead yield improvement activities using structured problem-solving methodologies (e.g., 8D, FMEA, DOE).

Establish and maintain key process control parameters and ensure compliance in production.

Drive continuous yield improvement to meet internal targets and customer expectations.

2. Process Robustness & Improvement

Develop and optimize bonding recipes (force, ultrasonic power, time, temperature, etc.).

Improve process stability and robustness against material and environmental variations.

Conduct Design of Experiments (DOE) to validate process changes and improvements.

Implement process standardization and best practices across production lines.

3. Tooling & Equipment Management

Study and monitor bonding tool (capillary/wedge) life performance and wear-out mechanisms.

Define tool life criteria, replacement frequency, and optimization strategies.

Collaborate with equipment and maintenance teams to ensure machine performance and uptime.

Support equipment troubleshooting and qualification.

4. Customer Support & Technical Interface

Respond to customer inquiries, complaints, and technical requests in a timely manner.

Perform failure analysis and provide clear, data-supported reports to customers.

Participate in customer audits, technical reviews, and meetings as required.

Ensure alignment of process capability with customer specifications and requirements.

5. Documentation & Reporting

Maintain accurate process documentation, work instructions, and specifications.

Prepare technical reports, yield analysis, and improvement updates.

Ensure compliance with quality management systems and industry standards.

6. Cross-Functional Collaboration

Work closely with Quality, Production, Maintenance, and Engineering teams.

Provide technical training and guidance to operators and technicians.

Lead or participate in continuous improvement and cost-reduction initiatives. Ensure 5s implementation and enforcement.

TECHNICAL SKILLS & COMPETENCIES

Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, or related field).

Experience in semiconductor assembly, specifically wedge bonding or wire bonding processes.

Strong knowledge of statistical analysis and problem-solving tools (SPC, DOE, FMEA).

Familiarity with bonding equipment and materials (Al wire, substrates, etc.).

Good communication skills for customer interaction and reporting.