Assembly Die Bond Process Engineer

NXP Semiconductors; Kuala Lumpur; On-site; MYR 120,000 - 180,000; Full time

Job summary

NXP Semiconductors in Malaysia is seeking an Assembly Die Bond Engineer to develop, optimize, and sustain die bonding processes for semiconductor packages, with a focus on quality, yield, and cycle-time reduction. You will provide daily engineering support, troubleshoot die bond issues, analyze yield losses, and drive CAPA and continuous improvement using Lean and Six Sigma methodologies.

Qualification: Bachelor/Master in related engineering with semiconductor die bond experience; document

Qualifications

• Bachelor’s or Master’s degree in a related engineering field with semiconductor or die bonding experience.
• Experience developing, qualifying, and sustaining die bonding processes.
• Strong problem solving and analytical skills; capable of root cause analysis.
• Familiarity with Lean Manufacturing and Six Sigma methodologies.

Responsibilities

• Develop, qualify, and optimize die bonding processes for semiconductor packages.
• Establish process parameters and operating specifications; support new package development and transfers.
• Provide daily engineering support to manufacturing operations and troubleshoot die bond issues.
• Analyze yield losses and process excursions; implement CAPA and continuous improvement actions.
• Monitor process capability (Cp/Cpk) and ensure compliance with quality standards.

Skills

Die bonding

Process optimization

CAPA

Troubleshooting

Lean Six Sigma

Education

Bachelor's or Master's degree in related engineering

Job description

Job Summary The Assembly Die Bond Engineer is responsible for developing, optimizing, and sustaining die bonding processes within semiconductor assembly manufacturing. The role focuses on achieving high product quality, yield improvement, process stability, cycle time reduction, and cost efficiency while supporting new product introductions (NPI) and continuous improvement initiatives.

Key Responsibilities

Process Development & Optimization

• Develop, qualify, and optimize die bonding processes for semiconductor packages.
• Establish process parameters and operating specifications.
• Perform process characterization and verification activities.
• Support new package development and technology transfers.

Production Support

• Provide daily engineering support to manufacturing operations.
• Troubleshoot die bondprocess-related issues.
• Analyze yield losses and process excursions.
• Implement corrective and preventive actions (CAPA).

Quality & Reliability

• Monitor process capability (Cp/Cpk) and manufacturing yields.
• Conduct root cause analysis using tools such as 8D, Fishbone, 5 Why, and FMEA.
• Ensure compliance with quality standards and customer requirements.
• Support reliability testing and qualification activities.

Continuous Improvement

• Drive cost reduction, productivity enhancement, and waste elimination projects.
• Utilize Lean Manufacturing and Six Sigma methodologies.
• Lead or participate in continuous improvement initiatives.

Documentation & Compliance

Create and maintain process documentation, work instructions, and specifications.

Prepare engineering reports, qualification reports, and technical presentations.

Ensure compliance with safety, environmental, and company standards.

Qualification: Bachelor/Master in related engineering major with semiconductor experience in Die bond.

More information about NXP in Malaysia... #LI-633a NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets.

Bright Minds. Bright Futures. We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.

Commitment At NXP. We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress.

Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality.

Thank you for considering a career at NXP.

Thank you for your interest in supporting our recruitment efforts.

Please note that NXP operates under a strict Preferred Supplier List (PSL) for all recruitment activities. Any candidate profiles or resume submitted without a prior written agreement or explicit request from our Talent Acquisition team will be considered unsolicited. Such submissions will be deemed free of any obligations, and no fees will be paid by NXP or any of its affiliates, subsidiaries, or divisions - regardless of whether the candidate is hired, either coincidentally or otherwise. Thank you for your understanding.