Senior Staff Engineer Unit Process Engineering

Infineon Technologies AG; Malacca City; On-site; MYR 180,000 - 300,000; Full time

Job summary

Infineon Technologies AG in Malacca seeks a Senior Staff Engineer to lead die bond and front‑of‑line process development. You will drive robust manufacturing processes, mentor teams, and deliver improvements in yield, quality, and cost.

The role requires 8+ years in FOL/Die Bond, strong data analytics, and proven troubleshooting skills. You will collaborate across functions to ensure reliable, scalable production and continuous improvement. Experience in semiconductor assembly is essential.

Qualifications

• Bachelor's degree in an engineering field listed in the qualifications.
• 8+ years in FOL/Die Bond or semiconductor assembly environments.
• Strong data analysis, analytical thinking and problem-solving skills.
• Proven ability to anticipate issues and implement solutions quickly.
• Expert process engineering knowledge with manufacturing equipment familiarity.
• Ability to use 8D, DMAIC, Process Mapping, FTA, Fishbone diagrams.

Responsibilities

• Develop robust manufacturing processes and lead improvements for yield/quality KPIs.
• Sustain and enhance process performance to meet customer expectations on cost and delivery.
• Ensure control plan deployment and quality control requirements are met.
• Demonstrate expertise in Front‑of‑Line Die Bond processes.
• Deliver measurable business impact within the unit.

Skills

Statistical data analysis

Analytical thinking

Problem-solving

Structured problem-solving

Cross-functional communication

Education

Bachelor's degree in Mechanical/Electrical/Electronics/Mechatronics/Semiconductor Technology

Tools

8D

DMAIC

Process Mapping

FTA

Fishbone Diagram

Job description

Senior Staff Engineer Unit Process Engineering

As part of our team you will merge creativity with technical expertise to shape the future of technology, drive groundbreaking projects, and bring new ideas to life.

Your Role

• Responsible for developing robust manufacturing processes and continuously driving & leading the team for improvement in yield and quality to meet KPIs
• Sustain and enhance process performance to consistently deliver products that meet customer expectations in functionality, reliability, delivery timelines, volume, and cost
• Ensure compliance with control plan deployment and quality control requirements, with a strong understanding of key parameter definitions and controls
• Possess strong Front-of-Line (FOL) process engineering expertise, with specialization in Die Bond operation
• Demonstrate measurable impact on business results within organizational area

Your Profile

• Bachelor's Degree in Mechanical Engineering, Electrical Engineering, Electronics Engineering, Microelectronics, Mechatronics, Materials Science, Semiconductor Technology, or an equivalent discipline
• Minimum 8 years of related experience in FOL/ Die Bond Process Engineering or within a Semiconductor Assembly Manufacturing environment
• Strong statistical data analysis, analytical thinking, and problem-solving skills
• Proven ability to anticipate potential issues and challenges, and implement effective solutions promptly
• Expert-level process engineering knowledge with strong understanding of manufacturing processes and related equipment
• Proficient in structured problem-solving methodologies, including 8D, DMAIC, Process Mapping, FTA (Fault Tree Analysis), Fishbone Diagram, and other continuous improvement tools
• Good knowledge of production operations with the ability to communicate effectively across all levels of the organization
• Solid understanding of first-level reliability, including various failure modes, application requirements, reliability standards, and testing methodologies
• Demonstrates high-performance behavior and collaborates effectively within cross-functional teams to achieve operational excellence

Equal Opportunity Statement

We base our recruiting decisions on the applicant's experience and skills.