HBM Layout Engineer for AI & HPC - Guadalajara

Micron Technology, Inc.; Tlaquepaque; Hybrid; MXN 420,000 - 660,000; Full time

Job summary

Micron Technology, Inc. in Tlaquepaque, Jalisco, Mexico is seeking an NCG Engineer for HBM layout. You will craft IC layouts for leaf, standard cells and sub-blocks, and interpret DRC/LVS results to ensure precise, efficient designs.

You will collaborate with global engineering teams to drive layout projects and learn advanced semiconductor techniques for high‑bandwidth memory solutions.

Qualifications

• Bachelor’s, master’s, or PhD in Electronics, Mechatronics, Robotics or Nanotechnology.
• Content from HTML is retained; qualifications must be supported.
• Graduation from program within the past two years.
• Proficiency in circuit concepts and electronic design tools.
• Conversational English proficiency and willingness to learn.

Responsibilities

• Craft and develop IC layouts for leaf cells, standard cells, and sub-blocks.
• Interpret DRC/LVS and other verification results to support accurate layouts.
• Apply a detail-focused, systematic approach to layout planning and verification.
• Collaborate with internal teams across global locations on layout projects.

Skills

Layout design

DRC/LVS interpretation

Electronic circuit concepts

English communication

Problem solving

Education

Bachelor's/Master's/PhD in Electronics or related field

Tools

Cadence VLE/VXL

Calibre DRC/LVS

Mentor Graphics/Siemens tools

Job description

Micron Technology, Inc. in Tlaquepaque, Jalisco, Mexico is seeking an NCG Engineer for HBM layout. You will craft IC layouts for leaf, standard cells and sub-blocks, and interpret DRC/LVS results to ensure precise, efficient designs.

You will collaborate with global engineering teams to drive layout projects and learn advanced semiconductor techniques for high‑bandwidth memory solutions.