HBM IC Layout Engineer – Early Career

Micron Technology, Inc.; Tlaquepaque; On-site; MXN 450,000 - 650,000; Full time

Job summary

Micron Technology, Inc. in Guadalajara, Mexico, is seeking an NCG Engineer – HBM Layout to craft IC layouts for leaf and standard cells, focusing on performance, power, area, and design efficiency.

You will interpret DRC/LVS results and collaborate with global teams on challenging HBM projects. The role demands a solid electronics background, familiarity with layout tools, and strong problem-solving skills, with English communication for cross‑site collaboration and continuous learning in

Qualifications

• Bachelor’s, master’s, or PhD in Electronics, Mechatronics, Robotics Engineering, Nanotechnology, or related field.
• Graduation from the program within the past two years.
• Strong understanding of electronic circuit concepts and proficiency in circuit simulation or design tools.
• Conversational English proficiency.
• Interest in semiconductor technology with motivation to learn, collaborate, and develop technical expertise.

Responsibilities

• Craft and develop IC layouts for leaf cells, standard cells, and sub-blocks with attention to performance, power, area, capacitance, and design efficiency.
• Interpret DRC/LVS and other physical verification results to support accurate layouts.
• Apply a systematic, detail-focused approach to problem-solving and physical verification while planning work efficiently.
• Collaborate with internal engineering teams across global locations to drive layout projects.
• Continue to learn and develop semiconductor design skills while contributing to HBM solutions.

Skills

Electronic circuit concepts

English communication

Problem solving

C++ or Python programming

Education

Bachelor/Master/PhD in Electronics or related fields

Tools

Cadence VLE/VXL

Calibre DRC/LVS

Python scripting

Job description

Micron Technology, Inc. in Guadalajara, Mexico, is seeking an NCG Engineer – HBM Layout to craft IC layouts for leaf and standard cells, focusing on performance, power, area, and design efficiency.

You will interpret DRC/LVS results and collaborate with global teams on challenging HBM projects. The role demands a solid electronics background, familiarity with layout tools, and strong problem-solving skills, with English communication for cross‑site collaboration and continuous learning in