Technician : FOL - Plasma, Wire Bond (WB) & AOI

CG Semi; Sanand; On-site; INR 420,000 - 640,000; Full time

Job summary

CG SEMI is seeking hands-on Technicians for FOL, Plasma, Wire Bond, and AOI roles to support high-volume semiconductor assembly. You will handle plasma surface treatment, wire bonding, and automated optical inspection with emphasis on process discipline and defect identification.

The role requires strength in equipment setup, troubleshooting, and adherence to cleanroom and safety standards in a shift-based environment. Openings are in Sanand, Gujarat with 3 positions available.

Qualifications

• Diploma/ITI Electronics or equivalent; relevant discipline required.
• Hands-on experience with Plasma, Wire Bond and AOI equipment.
• Exposure to semiconductor back-end processes and SOP adherence.

Responsibilities

• Operate Plasma, Wire Bond and AOI equipment per SOPs.
• Perform machine setup, recipe selection and parameter checks.
• Support plasma cleaning and surface-treatment prior to bonding.
• Monitor wire bonding operations and ensure process consistency.
• Identify common bonding defects and assist troubleshooting.

Skills

Wire Bonding

Plasma Cleaning

AOI Equipment

Equipment Troubleshooting

Cleanroom Protocols

Education

Diploma / ITI Electronics / ECE

Tools

AOI Systems

Wire Bond Equipment

Plasma Equipment

Process Monitoring

Job description

CG SEMI | WE ARE HIRING

Role : Technician FOL | Plasma, Wire Bond (WB) & AOI

Function: Manufacturing / Engineering | Semiconductor Assembly
Position / TA Code: CGS-TA-TECH-FOL-PWBAOI-003
Location: Sanand, Gujarat
Openings: 3
Experience: 03 -08 Years
Qualification: Diploma / ITI Electronics / ECE / relevant discipline
Industry Preference: Semiconductor | OSAT | ATMP | IDM Backend Manufacturing
Process Focus: FOL | Plasma | Wire Bond (WB) | AOI

ROLE OVERVIEW

CG SEMI is looking for hands‑on Technicians – FOL | Plasma, Wire Bond & AOI to support high‑volume semiconductor assembly operations across plasma surface treatment, wire bonding and automated optical inspection.

The role requires strong equipment discipline, process monitoring, defect identification and first‑level troubleshooting to maintain stable production, quality and equipment uptime.

KEY RESPONSIBILITIES

• Operate and support Plasma, Wire Bond and AOI equipment as per approved SOPs and process specifications.
• Perform machine setup, recipe selection, parameter verification and production lot processing.
• Support plasma cleaning / surface-treatment operations prior to bonding.
• Monitor Wire Bond operations including wire feeding, bonding alignment and process consistency.
• Identify and upscale bonding abnormalities including non-stick on pad, non-stick on lead, wire sweep, broken wire, missing wire, shorting and bond-position abnormalities.
• Operate AOI systems and support detection, classification and segregation of visual defects.
• Respond to equipment alarms and perform basic troubleshooting and recovery as per standard procedures.
• Carry out routine equipment inspection, cleaning and first‑level preventive maintenance.
• Support Process and Equipment Engineers during equipment qualification, process trials, NPI and production ramp-up.
• Maintain accurate production, equipment and process records.
• Follow ESD, cleanroom, safety, quality and 5S requirements.

CANDIDATE PROFILE

• 03–08 years of relevant semiconductor manufacturing/equipment experience.
• Hands‑on exposure to Plasma, Wire Bond and/or AOI equipment.
• Knowledge of wire‑bonding processes and common bonding defects.
• Exposure to AOI inspection and visual defect identification.
• Ability to perform equipment setup, recipe checks and first‑level troubleshooting.
• Understanding of semiconductor manufacturing SOPs and process discipline.
• OSAT, ATMP or IDM backend semiconductor manufacturing experience preferred.
• Comfortable working in a cleanroom and shift‑based high‑volume manufacturing environment.

WHAT WE LOOK FOR

Safety-first mindset | Quality discipline | Hands‑on equipment skills | Attention to detail | Process discipline | Defect identification | Problem solving | Shift flexibility | Team collaboration

KEY SKILLS

Wire Bond | Wire Bonding | WB | Plasma | Plasma Cleaning | Plasma Treatment | AOI | Automated Optical Inspection | Bonding | Semiconductor Assembly | Semiconductor Packaging | FOL | OSAT | ATMP | IDM | Backend Manufacturing | Equipment Technician | Equipment Operation | Preventive Maintenance | NPI | ESD | Cleanroom | 5S

ALENT ACQUISITION CONTACT

MR SIDDHARTH JAIN
Global Talent Acquisition Head | CG SEMI

LinkedIn: https://www.linkedin.com/in/sidsjain/

CG SEMI :Building India's semiconductor manufacturing capability