Technician : FOL - BG To UV

CG Semi; Sanand; On-site; INR 200,000 - 300,000; Full time

Job summary

CG SEMI is seeking a hands-on Technician FOL | BG to UV to support high-volume semiconductor assembly. You will work on Back Grinding, wafer handling and UV processes, focusing on equipment operation, process discipline, quality, safety and production stability.

This role requires 3–8 years of relevant experience and a Diploma/ITI in Electronics or related fields. You will operate BG and UV process equipment, perform setup and verification, monitor parameters, and assist engineers with

Qualifications

• Diploma / ITI Electronics / ECE or relevant discipline required.
• Hands-on experience with back grinding and wafer handling preferred.
• Experience in semiconductor assembly/manufacturing preferred.
• Ability to perform machine setup, recipe checks and basic troubleshooting.
• Exposure to cleanroom practices and shift-based manufacturing.

Responsibilities

• Operate and support Back Grinding and UV process equipment as per SOPs.
• Perform machine setup, recipe selection, parameter verification and production lot processing.
• Handle wafers through BG and subsequent process stages with proper handling controls.
• Monitor equipment parameters, alarms and process abnormalities during production.
• Perform routine equipment inspections, cleaning and first-level preventive maintenance.
• Identify and escalate wafer damage, grinding abnormalities, thickness variation and defects.
• Support engineers during troubleshooting, qualification, and trials.
• Maintain accurate production, equipment and process records.
• Comply with ESD, cleanroom, safety, quality and 5S requirements.
• Support improvements for yield, productivity, uptime and process stability.

Skills

Back Grinding

Wafer Handling

UV Process

FOL

Equipment Operation

5S

Cleanroom

Shift-based

Education

Diploma / ITI Electronics / ECE

Job description

CG SEMI | WE ARE HIRING

Role : Technician FOL | BG to UV

Function: Manufacturing / Engineering | Semiconductor Assembly
Position / TA Code: CGS-TA-TECH-FOL-BGUV-001
Location: Sanand, Gujarat
Openings: 3
Experience: 38 Years
Qualification: Diploma / ITI Electronics / ECE / relevant discipline
Discipline: Electronics

Industry Preference: Semiconductor | OSAT | ATMP | IDM Backend Manufacturing
Process Focus: FOL | Back Grinding (BG) | Wafer Handling | UV Process

ROLE OVERVIEW

CG SEMI is looking for a hands‑on Technician FOL | BG to UV to support high‑volume semiconductor assembly operations involving Back Grinding, wafer handling and UV processes, with a strong focus on equipment operation, process discipline, quality, safety and production stability.

KEY RESPONSIBILITIES

• Operate and support Back Grinding and UV process equipment as per approved SOPs and process specifications.
• Perform machine setup, recipe selection, parameter verification and production lot processing.
• Handle wafers through BG and subsequent process stages while maintaining appropriate handling controls.
• Monitor equipment parameters, alarms and process abnormalities during production.
• Perform routine equipment inspections, cleaning and first-level preventive maintenance.
• Identify and escalation wafer damage, grinding abnormalities, thickness variation, handling issues and equipment-related defects.
• Support Process and Equipment Engineers during troubleshooting, qualification, engineering trials and NPI.
• Maintain accurate production, equipment and process records.
• Follow ESD, cleanroom, safety, quality and 5S requirements.
• Support improvement initiatives related to yield, productivity, equipment uptime and process stability.

CANDIDATE PROFILE

• 03 - 08 years of relevant manufacturing/equipment experience.
• Hands‑on exposure to Back Grinding, wafer handling and/or UV processes preferred.
• Semiconductor assembly/manufacturing experience is highly preferred.
• Ability to perform machine setup, recipe checks and basic equipment troubleshooting.
• Understanding of manufacturing SOPs and process discipline.
• Exposure to OSAT, ATMP or IDM backend semiconductor manufacturing will be an advantage.
• Comfortable working in a cleanroom and shift‑based manufacturing environment.

WHAT WE LOOK FOR

Safety-first mindset | Quality discipline | Hands‑on equipment skills | Process discipline | Problem solving | High-volume manufacturing orientation | Shift flexibility | Team collaboration

KEY SKILLS

Back Grinding | BG | Wafer Grinding | Wafer Handling | Wafer Thinning | UV Process | FOL | Semiconductor Assembly | Semiconductor Manufacturing | Semiconductor Packaging | OSAT | ATMP | IDM | Equipment Operation | Equipment Technician | Preventive Maintenance | ESD | Cleanroom | 5S

TALENT ACQUISITION CONTACT

Siddharth Jain
Global Talent Acquisition Head | CG SEMI

LinkedIn: https://www.linkedin.com/in/sidsjain

Building India's semiconductor manufacturing capability