Technician : FOL - Die Attach and DA Cure

CG Semi; Sanand; On-site; INR 250,000 - 350,000; Full time

Job summary

CG SEMI is seeking hands-on Technicians FOL (Die Attach & DA Cure) to support high-volume semiconductor assembly operations, including die attach, die placement and post-die-attach curing processes.

The role requires strong equipment discipline, process monitoring, defect identification and first-level troubleshooting to maintain production stability, quality and uptime.

Qualifications

• Diploma/ITI in Electronics or related discipline required.
• Hands-on experience with semiconductor assembly processes preferred.
• Exposure to Die Attach, Die Cure and related tooling is essential.

Responsibilities

• Operate Die Attach and DA Cure equipment per SOPs.
• Perform machine setup, recipe checks and parameter verification.
• Support die pick-up, alignment and placement operations.
• Monitor process parameters to ensure die placement quality.
• Maintain equipment records and perform basic preventive maintenance.
• Assist engineers with qualification, trials and ramp-up.

Skills

Die Attach

DA Cure

Die Bonding

Die Placement

Die Pick & Place

Equipment Operation

Process Discipline

ESD & Cleanroom

Shift Flexibility

Education

Diploma / ITI Electronics / ECE

Job description

CG SEMI | WE ARE HIRING

Role : Technician FOL | Die Attach (DA) & DA Cure

Function: Manufacturing / Engineering | Semiconductor Assembly

Position / TA Code: CGS-TA-TECH-FOL-DACURE-002

Location: Sanand, Gujarat

Openings: 2

Experience: 38 Years

Qualification: Diploma / ITI Electronics / ECE / relevant discipline

Discipline: Electronics

Industry Preference: Semiconductor | OSAT | ATMP | IDM Backend Manufacturing

Process Focus: FOL | Die Attach (DA) | DA Cure | Die Placement

ROLE OVERVIEW

CG SEMI is looking for hands-on Technicians FOL | Die Attach & DA Cure to support high-volume semiconductor assembly operations involving die attach, die placement and post-die-attach curing processes.

The role requires strong equipment discipline, process monitoring, defect identification and first-level troubleshooting to support stable production, quality and equipment uptime.

KEY RESPONSIBILITIES

• Operate and support Die Attach and DA Cure equipment as per approved SOPs and process specifications.
• Perform machine setup, recipe selection, parameter verification and production lot processing.
• Support die pick-up, alignment, placement and attachment operations.
• Monitor critical process parameters for consistent die placement and attachment quality.
• Operate and monitor DA curing equipment, including specified time and temperature parameters.
• Identify and elevate defects including die shift, die rotation, misalignment, missing die, die cracking/chipping and attachment-related abnormalities.
• Perform routine equipment inspection, cleaning and first-level preventive maintenance.
• Respond to equipment alarms and support basic troubleshooting and recovery.
• Assist Process and Equipment Engineers with equipment/process qualification, NPI, engineering trials and production ramp-up.
• Maintain accurate production, equipment and process records.
• Follow ESD, cleanroom, safety, quality and 5S requirements.

CANDIDATE PROFILE

• 38 years of relevant manufacturing/equipment experience.
• Hands-on semiconductor experience in Die Attach and/or DA Cure preferred.
• Exposure to die bonding, die pick-and-place, alignment and placement processes.
• Ability to perform equipment setup, recipe checks and first-level troubleshooting.
• Understanding of die-related defects and basic process controls.
• OSAT, ATMP or IDM backend semiconductor manufacturing experience preferred.
• Comfortable working in a cleanroom and shift-based manufacturing environment.

WHAT WE LOOK FOR

Safety-first mindset | Quality discipline | Hands-on equipment skills | Process discipline | Attention to detail | Problem solving | Shift flexibility | Team collaboration | High-volume manufacturing orientation

KEY SKILLS

Die Attach | DA | DA Cure | Die Bonding | Die Placement | Die Pick & Place | Pick and Place | Die Attach Technician | Semiconductor Assembly | Semiconductor Packaging | FOL | OSAT | ATMP | IDM | Backend Manufacturing | Equipment Operation | Equipment Technician | Preventive Maintenance | NPI | ESD | Cleanroom | 5S

CG SEMI :Building India's semiconductor manufacturing capability