Process Engineer - PBGA Ball Attach, Reflow & Flux Clean

CG Semi; Sanand; On-site; INR 900,000 - 1,400,000; Full time

Job summary

CG SEMI is seeking a hands-on Process Engineer PBGA to own and optimize PBGA, ball attach, flux application, reflow and post-reflow cleaning in a high‑volume semiconductor assembly environment.

The role requires strong knowledge of solder-ball placement, flux application, reflow profiling and cleaning, plus experience with process qualification, NPI and ramp‑up. OSAT/ATMP/ IDM experience is preferred.

Qualifications

• Own and optimize PBGA/BGA solder-ball attach, flux application, reflow and post-reflow cleaning.
• Develop and optimize process recipes, process windows, control plans, SOPs and reaction plans.
• Troubleshoot missing/shifted balls, bridging, non-wet joints, solder voids, contamination and flux residue.
• Develop and optimize reflow profiles for solder-joint integrity and consistent process performance.
• Drive equipment/process qualification, NPI and mass‑production ramp‑up.
• Lead process improvement using DOE, SPC, Cp/Cpk, FMEA and 8D and root‑cause analysis.
• Monitor process capability, defect trends and yield performance and implement corrective/preventive actions.
• Collaborate with Equipment, Manufacturing, Quality, Product and Reliability Engineering teams.

Responsibilities

• Own and optimize PBGA/BGA solder-ball attach, flux application, reflow and post-reflow cleaning.
• Develop and optimize process recipes, process windows, control plans, SOPs and reaction plans.
• Troubleshoot missing/shifted balls, bridging, non-wet joints, solder voids, contamination and flux residue.
• Develop and optimize reflow profiles for solder-joint integrity and consistent process performance.
• Drive equipment/process qualification, NPI and mass‑production ramp‑up.
• Lead process improvement using DOE, SPC, Cp/Cpk, FMEA and 8D and root‑cause analysis.
• Monitor process capability, defect trends and yield performance and implement corrective/preventive actions.
• Collaborate with Equipment, Manufacturing, Quality, Product and Reliability Engineering teams.

Skills

PBGA/BGA Ball Attach

Reflow

Flux Cleaning

DOE

SPC

Cp/Cpk

FMEA

8D

Yield Improvement

Defect Analysis

Education

B.E. / B.Tech / Diploma in relevant Engineering discipline

Job description

Role: Process Engineer PBGA | Ball Attach, Reflow & Flux Clean

Function: Engineering | Semiconductor Assembly
Position / TA Code: CGS-TA-PE-PBGA-001
Location: Sanand, Gujarat
Openings: 2
Experience: 03 - 10 Years
Qualification: B.E. / B.Tech / Diploma in relevant Engineering discipline
Industry Preference: Semiconductor | OSAT | ATMP | IDM Backend Manufacturing
Process Focus: PBGA | Ball Attach | Reflow | Flux Clean

ROLE OVERVIEW

CG SEMI is looking for a hands‑on Process Engineer PBGA to drive process ownership, optimization, qualification, yield improvement and production stability across Ball Attach, Reflow and Flux Cleaning processes in a high‑volume semiconductor assembly environment.

KEY RESPONSIBILITIES

• Own and optimize PBGA/BGA solder-ball attach, flux application, reflow and post-reflow cleaning processes.
• Develop and optimize process recipes, process windows, control plans, SOPs and reaction plans.
• Troubleshoot missing/shifted balls, bridging, non-wet joints, solder voids, contamination and flux residue.
• Develop and optimize reflow profiles for solder-joint integrity and consistent process performance.
• Drive equipment/process qualification, NPI and mass‑production ramp‑up.
• Lead process improvement using DOE, SPC, Cp/Cpk, FMEA, 8D and root‑cause analysis.
• Monitor process capability, defect trends and yield performance and implement corrective/preventive actions.
• Collaborate with Equipment, Manufacturing, Quality, Product and Reliability Engineering teams.

CANDIDATE PROFILE

• 310 years of relevant semiconductor assembly/process engineering experience.
• Hands‑on experience in PBGA/BGA Ball Attach and Reflow processes.
• Strong knowledge of solder-ball placement, flux application, reflow profiling and cleaning.
• Experience in solder‑joint defect analysis, process troubleshooting and yield improvement.
• Working knowledge of DOE, SPC, Cp/Cpk, FMEA and 8D.
• OSAT, ATMP or IDM backend semiconductor manufacturing experience preferred.
• Strong process ownership and hands‑on manufacturing mindset.

WHAT WE LOOK FOR

Safety-first mindset | Quality discipline | Strong process ownership | Hands‑on problem solving | Data‑driven decision making | Continuous improvement | Team collaboration | High‑volume manufacturing orientation

KEY SKILLS

PBGA | BGA | Ball Attach | Solder Ball Attach | Solder Ball | Reflow | Reflow Profiling | Flux | Flux Clean | Flux Cleaning | Solder Joint | Semiconductor Packaging | Semiconductor Assembly | OSAT | ATMP | Backend Manufacturing | Process Engineering | NPI | DOE | SPC | Cp/Cpk | FMEA | 8D | Yield Improvement | Defect Analysis | Root Cause Analysis

TALENT ACQUISITION CONTACT

Siddharth Jain
Global Talent Acquisition Head | CG SEMI

LinkedIn: linkedin.com/in/sidsjain

CG SEMI :Building India's semiconductor manufacturing capability