Technician : EOL - Mold, Plasma & Detape

CG Semi; Sanand; Hybrid; INR 300,000 - 420,000; Full time

Job summary

CG SEMI in Sanand, Gujarat, seeks a hands-on Technician – EOL | Mold, Plasma & Detape to support high-volume semiconductor packaging operations across molding, plasma treatment and detape processes. The role emphasizes equipment discipline, process monitoring, defect identification and first-level troubleshooting to ensure stable production, package quality and uptime.

You will perform setup, parameter checks, and maintain records while following safety and cleanroom standards in a shift-based

Qualifications

• Experience with molding equipment and plasma/ detape processes in semiconductor packaging.
• Ability to operate and troubleshoot standard equipment per SOPs.
• Understand SOPs, process controls and preventive maintenance.

Responsibilities

• Operate and support Mold, Plasma and Detape equipment per SOPs.
• Setup machines, select recipes, verify parameters and process lots.
• Monitor molding process parameters and equipment conditions.
• Support plasma cleaning and surface treatment processes and ensure conditions.
• Operate and monitor detape processes while maintaining material handling.
• Identify defects such as mold voids, resin bleed, delamination and contamination.
• Respond to alarms and perform basic troubleshooting and recovery.
• Carry out routine inspections, cleaning and basic PM.
• Support engineers during equipment qualification, trials and ramp-up.

Skills

Mold

Plasma

Detape

Equipment operation

First-level troubleshooting

Education

Diploma / ITI Mechanical / relevant discipline

Job description

CG SEMI | WE ARE HIRING

Role : Technician EOL | Mold, Plasma & Detape

Function: Manufacturing / Engineering | Semiconductor Assembly
Position / TA Code: CGS-TA-TECH-EOL-MPD-004
Location: Sanand, Gujarat
Openings: 3
Experience: 03-08 Years
Qualification: Diploma / ITI Mechanical / relevant discipline
Discipline: Mechanical
Industry Preference: Semiconductor | OSAT | ATMP | IDM Backend Manufacturing
Process Focus: EOL | Molding | Plasma | Detape

ROLE OVERVIEW

CG SEMI is looking for a hands‑on Technician – EOL | Mold, Plasma & Detape to support high-volume semiconductor packaging operations across molding, plasma treatment and detape processes.

The role requires strong equipment discipline, process monitoring, defect identification and first‑level troubleshooting to support stable production, package quality and equipment uptime.

KEY RESPONSIBILITIES

• Operate and support Mold, Plasma and Detape equipment as per approved SOPs and process specifications.
• Perform machine setup, recipe selection, parameter verification and production lot processing.
• Monitor critical molding process parameters and equipment conditions during production.
• Support plasma cleaning / surface‑treatment processes and verify required process conditions.
• Operate and monitor detape processes while ensuring package integrity and correct material handling.
• Identify and elevate defects including mold voids, incomplete mold, resin bleed/flash, delamination, package damage, contamination and detape‑related abnormalities.
• Respond to equipment alarms and perform basic troubleshooting and recovery as per standard procedures.
• Carry out routine equipment inspections, cleaning and first‑level preventive maintenance.
• Support Process and Equipment Engineers during equipment qualification, engineering trials, NPI and production ramp‑up.
• Maintain accurate production, equipment and process records.
• Follow ESD, cleanroom, safety, quality and 5S requirements.

CANDIDATE PROFILE

• 3–8 years of relevant manufacturing/equipment experience.
• Hands‑on experience in Mold, Plasma and/or Detape processes within semiconductor packaging preferred.
• Understanding of molding operations, plasma treatment and post‑mold handling.
• Exposure to semiconductor package defects and visual inspection.
• Ability to perform machine setup, recipe checks and first‑level equipment troubleshooting.
• Understanding of manufacturing SOPs, process controls and preventive maintenance requirements.
• OSAT, ATMP or IDM backend semiconductor manufacturing experience preferred.
• Comfortable working in a cleanroom and shift‑based high‑volume manufacturing environment.

WHAT WE LOOK FOR

Safety‑first mindset | Quality discipline | Hands‑on equipment skills | Process discipline | Attention to detail | Defect identification | Problem solving | Shift flexibility | Team collaboration

KEY SKILLS

Molding | Semiconductor Molding | Mold Process | Plasma | Plasma Cleaning | Plasma Treatment | Detape | Post Mold Process | EOL | Semiconductor Packaging | Semiconductor Assembly | OSAT | ATMP | IDM | Backend Manufacturing | Equipment Technician | Equipment Operation | Preventive Maintenance | NPI | ESD | Cleanroom | 5S

TALENT ACQUISITION CONTACT

MR SIDDHARTH JAIN
Global Talent Acquisition Head | CG SEMI

LinkedIn: https://www.linkedin.com/in/sidsjain/

CG SEMI :Building India's semiconductor manufacturing capability