Technician : EOL | Plating & Deflash

CG Semi; Sanand; On-site; INR 240,000 - 360,000; Full time

Job summary

CG SEMI is seeking a hands-on Technician – EOL | Plating & Deflash to support high-volume semiconductor packaging operations across plating, deflash and package-finishing processes.

The role requires strong equipment discipline, safe chemical/process handling, defect identification and first-level troubleshooting to maintain process stability, package quality, yield and equipment uptime.

Qualifications

• Diploma or ITI in Mechanical or related discipline.
• 3–8 years of manufacturing/equipment experience.
• Hands-on with plating and deflash processes in semiconductor packaging.
• Strong process discipline and safety awareness.
• Experience in first-level troubleshooting.

Responsibilities

• Operate and support Plating and Deflash equipment as per SOPs and process specs.
• Perform machine setup, process parameter verification and production lot processing.
• Monitor plating process conditions, including process sequence and equipment parameters.
• Support deflash operations and ensure effective removal of molding flash/residue without damage.
• Perform routine inspection of plated surfaces and finished packages.
• Identify and escalate abnormalities including plating non-uniformity and defects.
• Monitor equipment alarms and process deviations and perform basic troubleshooting.
• Carry out routine equipment inspection, cleaning and preventive maintenance.
• Follow procedures for chemical handling, PPE, waste management and safety.

Skills

Plating

Deflash

EOL

Package Finishing

Equipment Operation

Safety

Process Discipline

Shift-based Work

Cleanroom

Education

Diploma / ITI Mechanical / relevant discipline

Job description

CG SEMI | WE ARE HIRING

Role : Technician - EOL | Plating & Deflash

Function: Manufacturing / Engineering | Semiconductor Assembly
Position / TA Code: CGS-TA-TECH-EOL-PLDF-006
Location: Sanand, Gujarat
Openings: 2
Experience: 3- 8 Years
Qualification: Diploma / ITI Mechanical / relevant discipline
Discipline: Mechanical
Industry Preference: Semiconductor | OSAT | ATMP | IDM Backend Manufacturing
Process Focus: EOL | Plating | Deflash | Package Finishing

ROLE OVERVIEW

CG SEMI is looking for a hands-on Technician – EOL | Plating & Deflash to support high-volume semiconductor packaging operations across plating, deflash and package-finishing processes.

The role requires strong equipment discipline, safe chemical/process handling, defect identification and first-level troubleshooting to maintain process stability, package quality, yield and equipment uptime.

KEY RESPONSIBILITIES

• Operate and support Plating and Deflash equipment as per approved SOPs and process specifications.
• Perform machine setup, process parameter verification and production lot processing.
• Monitor plating process conditions, including process sequence and equipment parameters.
• Support deflash operations and ensure effective removal of molding flash/residue without package damage.
• Perform routine inspection of plated surfaces and finished semiconductor packages.
• Identify and escalation abnormalities including plating non-uniformity, discoloration, contamination, poor adhesion, surface defects, residual flash and package damage.
• Monitor equipment alarms and process deviations and perform basic troubleshooting as per standard procedures.
• Carry out routine equipment inspection, cleaning and first-level preventive maintenance.
• Follow defined procedures for chemical handling, PPE, waste management and workplace safety.
• Support Process and Equipment Engineers during equipment qualification, engineering trials, NPI and production ramp-up.
• Maintain accurate production, equipment, process and quality records.
• Follow ESD, cleanroom, safety, quality and 5S requirements.

CANDIDATE PROFILE

• 3–8 years of relevant manufacturing/equipment experience.
• Hands-on exposure to Plating and/or Deflash processes within semiconductor packaging preferred.
• Understanding of surface treatment, package finishing and plating-related defects.
• Experience in equipment operation, machine setup and first-level troubleshooting.
• Knowledge of safe chemical handling and PPE requirements in a manufacturing environment.
• Understanding of production SOPs, process controls and preventive maintenance.
• OSAT, ATMP or IDM backend semiconductor manufacturing experience preferred.
• Comfortable working in a cleanroom and shift-based high-volume manufacturing environment.

WHAT WE LOOK FOR

Safety-first mindset | Chemical safety discipline | Quality focus | Hands-on equipment skills | Process discipline | Attention to detail | Defect identification | Problem solving | Shift flexibility | Team collaboration

KEY SKILLS

Plating | Semiconductor Plating | Deflash | Package Deflash | Surface Treatment | Package Finishing | EOL | Semiconductor Packaging | Semiconductor Assembly | OSAT | ATMP | IDM | Backend Manufacturing | Equipment Technician | Equipment Operation | Chemical Handling | Preventive Maintenance | NPI | ESD | Cleanroom | 5S

TALENT ACQUISITION CONTACT

MR SIDDHARTH JAIN
Global Talent Acquisition Head | CG SEMI

LinkedIn: https://www.linkedin.com/in/sidsjain

Building India's semiconductor manufacturing capability