Technician : EOL - LM, TF, AOI & Package Saw

CG Semi; Sanand; On-site; INR 350,000 - 550,000; Full time

Job summary

CG SEMI is hiring a hands-on Technician EOL to support high-volume semiconductor assembly and package finishing operations at Sanand, Gujarat. You will perform equipment operation, process monitoring, defect identification and first-level troubleshooting to maintain production stability and yield.

The role requires hands-on setup, recipe verification and machine parameter checks across LM, TF, AOI, and Package Saw processes, with an emphasis on safety and quality in a cleanroom, shift-based

Qualifications

• Diploma in Mechanical or related discipline required.
• 3–8 years of hands-on manufacturing/equipment experience in semiconductor packaging.
• Experience with LM, TF, AOI and Package Saw processes is preferred.
• Comfortable working in a cleanroom and shift-based high-volume manufacturing environment.

Responsibilities

• Operate LM, TF, AOI and Package Saw equipment per SOPs.
• Perform machine setup, recipe checks and parameter verification.
• Support package forming, finishing, inspection and singulation operations.
• Identify and escalate abnormalities including defects and process deviations.
• Monitor equipment parameters and respond to alarms per procedures.
• Perform basic troubleshooting and preventive maintenance.
• Assist engineers during qualification, trials, and ramp-up.
• Maintain accurate production, equipment, process and quality records.

Skills

LM

TF

AOI

Package Saw

Equipment Operation

SOP compliance

Troubleshooting

Education

Diploma - Mechanical

Tools

LM

TF

AOI

Package Saw

Job description

CG SEMI | WE ARE HIRING

Role : Technician - EOL | LM, TF, AOI & Package Saw

Function: Manufacturing / Engineering | Semiconductor Assembly
Position / TA Code: CGS-TA-TECH-EOL-LTAOIPS-005
Location: Sanand, Gujarat
Openings: 3
Experience: 3 - 8 Years
Qualification: Diploma - Mechanical / relevant discipline
Industry Preference: Semiconductor | OSAT | ATMP | IDM Backend Manufacturing
Process Focus: EOL | LM | TF | AOI | Package Saw

ROLE OVERVIEW

CG SEMI is looking for a hands-on Technician EOL | LM, TF, AOI & Package Saw to support high-volume semiconductor assembly and package-finishing operations.

The role requires hands-on equipment operation, process monitoring, package inspection, defect identification and first-level troubleshooting to maintain production stability, package quality, equipment uptime and yield.

KEY RESPONSIBILITIES

• Operate and support LM, TF, AOI and Package Saw equipment as per approved SOPs and process specifications.
• Perform machine setup, recipe selection, parameter verification and production lot processing.
• Support package forming, finishing, inspection and singulation operations.
• Operate AOI systems and identify, classify and segregate visual/package defects.
• Operate and monitor Package Saw / singulation equipment, including blade and process-condition checks.
• Identify and escalation abnormalities including package chipping, cracking, burrs, dimensional deviations, incomplete cuts, package damage and visual defects.
• Monitor critical equipment parameters and respond to machine alarms in accordance with standard procedures.
• Perform basic troubleshooting, cleaning, inspection and first-level preventive maintenance.
• Support Process and Equipment Engineers during equipment qualification, engineering trials, NPI and production ramp-up.
• Maintain accurate production, equipment, process and quality records.
• Follow ESD, cleanroom, safety, quality and 5S requirements.

CANDIDATE PROFILE

• 38 years of relevant manufacturing/equipment experience.
• Hands-on exposure to LM, TF, AOI and/or Package Saw processes within semiconductor packaging preferred.
• Experience in package inspection, finishing and singulation will be advantageous.
• Ability to perform machine setup, recipe checks and first-level equipment troubleshooting.
• Understanding of package defects, dimensional requirements and visual inspection.
• Working knowledge of manufacturing SOPs and process controls.
• OSAT, ATMP or IDM backend semiconductor manufacturing experience preferred.
• Comfortable working in a cleanroom and shift-based high-volume manufacturing environment.

WHAT WE LOOK FOR

Safety-first mindset | Quality discipline | Hands-on equipment skills | Process discipline | Attention to detail | Defect identification | Problem solving | Shift flexibility | Team collaboration

KEY SKILLS

LM | TF | AOI | Automated Optical Inspection | Package Saw | Package Sawing | Singulation | Package Singulation | Package Inspection | Semiconductor Packaging | Semiconductor Assembly | EOL | OSAT | ATMP | IDM | Backend Manufacturing | Equipment Technician | Equipment Operation | Preventive Maintenance | NPI | ESD | Cleanroom | 5S