Process Engineer : PBGA - Chip Shooter

CG Semi; Sanand; On-site; INR 900,000 - 1,300,000; Full time

Job summary

CG Semi in Sanand, Gujarat is seeking a hands-on Process Engineer PBGA | Chip Shooter to drive process ownership, optimization, qualification, yield improvement and production stability for high-speed die placement within a high-volume semiconductor assembly environment.

The role requires strong understanding of equipment parameters, die placement accuracy, material handling, process controls and systematic troubleshooting to support stable production, NPI and ramp-up.

Qualifications

• Hands-on experience with Chip Shooter / high-speed die placement / die attach equipment and processes.
• Strong understanding of die pick-up, die placement, alignment and vision systems.
• Experience in equipment recipe setting, parameter optimization and process window development.

Responsibilities

• Own and optimize PBGA Chip Shooter / high-speed die placement processes for semiconductor assembly.
• Develop and optimize machine recipes, placement parameters, process windows, control plans and SOPs.
• Optimize die pick-up, alignment, placement accuracy, placement force and UPH/cycle time.
• Troubleshoot defects such as die shift, misalignment, missing or wrong die placement.
• Optimize vision, alignment and recognition parameters for consistent placement accuracy.
• Collaborate with Equipment Engineering on machine setup, calibration, preventive maintenance and qualification.
• Drive NPI, engineering builds, process qualification and mass-production ramp-up.
• Lead DOE, SPC, Cp/Cpk, FMEA, 8D and root-cause analysis for improvements.

Skills

Chip Shooter

High-speed die placement

Die pick-up & placement

Placement accuracy

Troubleshooting

DOE

SPC

Cp/Cpk

FMEA

8D

Root cause analysis

Education

B.E. / B.Tech / Diploma in relevant Engineering discipline

Tools

Vision systems

Equipment calibration

Job description

Role : Process Engineer PBGA | Chip Shooter

Function: Engineering | Semiconductor Assembly
Position / TA Code: CGS-TA-PE-PBGA-002
Location: Sanand, Gujarat
Openings: 2

Experience: 03 - 10 Years
Qualification: B.E. / B.Tech / Diploma in relevant Engineering discipline
Industry Preference: Semiconductor | OSAT | ATMP | IDM Backend Manufacturing

Process Focus: PBGA | Chip Shooter | Die Placement | Die Attach

ROLE OVERVIEW

CG SEMI is looking for a hands-on Process Engineer PBGA | Chip Shooter to drive process ownership, optimization, qualification, yield improvement and production stability for high-speed die placement / chip-shooter processes within a high-volume semiconductor assembly environment.

The role requires strong understanding of equipment parameters, die placement accuracy, material handling, process controls and systematic troubleshooting to support stable production, NPI and manufacturing ramp-up.

KEY RESPONSIBILITIES

• Own and optimize PBGA Chip Shooter / high-speed die placement processes for semiconductor assembly.
• Develop and optimize machine recipes, placement parameters, process windows, control plans, SOPs and reaction plans.
• Optimize die pick-up, alignment, placement accuracy, placement force, pick-and-place parameters and UPH/cycle time.
• Troubleshoot process defects including die shift, die rotation, misalignment, missing die, wrong die placement, die cracking/chipping and pick-up/placement failures.
• Optimize vision, alignment and recognition parameters to achieve consistent placement accuracy.
• Work closely with Equipment Engineering on machine setup, calibration, preventive maintenance and equipment/process qualification.
• Drive NPI, engineering builds, process qualification and mass-production ramp-up.
• Lead structured improvement activities using DOE, SPC, Cp/Cpk, FMEA, 8D and root-cause analysis.
• Monitor process capability, defect trends, equipment performance, UPH and yield and implement corrective/preventive actions.
• Collaborate closely with Equipment, Manufacturing, Quality, Product and Reliability Engineering teams.

CANDIDATE PROFILE

• 03-10 years of relevant semiconductor assembly/process engineering experience.
• Hands-on experience with Chip Shooter / high-speed die placement / die attach equipment and processes.
• Strong understanding of die pick-up, die placement, alignment, vision systems and placement accuracy.
• Experience in equipment recipe setting, parameter optimization and process window development.
• Strong troubleshooting exposure related to die shift, rotation, misalignment, die damage, missing die and placement defects.
• Experience in equipment/process qualification, NPI and high-volume manufacturing ramp-up.
• Working knowledge of DOE, SPC, Cp/Cpk, FMEA, 8D and structured root-cause analysis.
• OSAT, ATMP or IDM backend semiconductor manufacturing experience preferred.
• Strong process ownership and hands-on manufacturing mindset.

WHAT WE LOOK FOR

Safety-first mindset | Quality discipline | Strong process ownership | Equipment & process understanding | Hands-on troubleshooting | Data-driven decision making | Continuous improvement | Team collaboration | High-volume manufacturing orientation

KEY SKILLS

PBGA | Chip Shooter | Chip Placement | Die Placement | Die Attach | Die Pick & Place | Pick and Place | Semiconductor Assembly | Semiconductor Packaging | Vision Alignment | Placement Accuracy | Die Shift | Die Rotation | Die Crack | Equipment Qualification | Process Qualification | NPI | OSAT | ATMP | IDM | Backend Manufacturing | Process Engineering | DOE | SPC | Cp/Cpk | FMEA | 8D | Yield Improvement | Defect Analysis | Root Cause Analysis