Principal Semiconductor Packaging Engineer

JR United Kingdom; Swindon; On-site; GBP 40,000 - 70,000; Full time

Job summary

A leading client seeks a Principal Semiconductor Packaging Engineer in Swindon to drive their packaging strategy for quantum processors. This role requires strong expertise in semiconductor packaging methods, including die bonding and effective communication with suppliers, to ensure high-quality outcomes while developing innovative packaging techniques.

Qualifications

• Experience required in semiconductor packaging techniques and substrate technologies.
• Familiarity with thermal and mechanical performance criteria.
• Skills in managing supplier relationships and communication.

Responsibilities

• Steer the packaging roadmap for quantum processor devices.
• Develop and produce packaging methods for optimal performance.
• Design and supervise failure analysis experiments.

Skills

Experience of semiconductor/photonic packaging methods

Knowledge of die bonding methods

Experience working with 3rd party suppliers

Strong internal and external communication skills

Job description

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Principal Semiconductor Packaging Engineer, swindon, wiltshire

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Client:

IC Resources

Location:

swindon, wiltshire, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.