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Principal Semiconductor Packaging Engineer

JR United Kingdom

Woking

On-site

GBP 45,000 - 70,000

Full time

2 days ago
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Job summary

A leading edge company in Oxford seeks a Principal Semiconductor Packaging Engineer to guide the packaging roadmap for quantum processor devices. The role involves developing innovative packaging methods, working with various suppliers, and includes overseeing crucial experiments to ensure quality thermal performance.

Qualifications

  • Experience with semiconductor/photonic packaging methods and package substrate technologies.
  • Knowledge of die bonding for thermal and mechanical performance.
  • Experience working with third-party suppliers.

Responsibilities

  • Steer the packaging roadmap and work with internal/external providers on quantum processor devices.
  • Develop wirebond and bumping methods for good thermal performance.
  • Design and supervise failure analysis experiments.

Skills

Semiconductor Packaging Methods
Photonics Packaging Methods
Die Bonding Methods
Communication Skills

Job description

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Principal Semiconductor Packaging Engineer, woking

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Client:

IC Resources

Location:

woking, United Kingdom

Job Category:

Other

-

EU work permit required:

Yes

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Job Views:

3

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

  • Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
  • Knowledge of die bonding methods for good thermal and mechanical performance
  • Experience working with 3rd party suppliers
  • Strong internal and external communication skills

Please contact Rachel Anderson for further details.

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