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A leading edge Oxford-based company is seeking a Principal Semiconductor Packaging Engineer to lead the development of packaging methods for quantum processor devices. This role combines technical expertise with project management, as you will work with both internal teams and external suppliers to innovate packaging solutions.
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IC Resources
reading, United Kingdom
Other
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Yes
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2
04.06.2025
19.07.2025
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Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
Please contact Rachel Anderson for further details.