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Principal Semiconductor Packaging Engineer

JR United Kingdom

Reading

On-site

GBP 50,000 - 70,000

Full time

3 days ago
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Job summary

A leading edge Oxford-based company is seeking a Principal Semiconductor Packaging Engineer to lead the development of packaging methods for quantum processor devices. This role combines technical expertise with project management, as you will work with both internal teams and external suppliers to innovate packaging solutions.

Qualifications

  • Experience in semiconductor/photonic packaging.
  • Knowledge of die bonding and substrate technologies.
  • Experience working with 3rd party suppliers.

Responsibilities

  • Steer the packaging roadmap and work with providers.
  • Develop and produce quantum processor devices.
  • Design and supervise failure analysis experiments.

Skills

Semiconductor packaging methods
Photonics packaging methods
Thermal performance knowledge
Mechanical performance knowledge
External communication skills
Internal communication skills

Job description

Social network you want to login/join with:

Principal Semiconductor Packaging Engineer, reading

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Client:

IC Resources

Location:

reading, United Kingdom

Job Category:

Other

-

EU work permit required:

Yes

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

  • Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
  • Knowledge of die bonding methods for good thermal and mechanical performance
  • Experience working with 3rd party suppliers
  • Strong internal and external communication skills

Please contact Rachel Anderson for further details.

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