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A leading company in quantum processing is seeking a Principal Semiconductor Packaging Engineer to guide their packaging roadmap. This role requires developing innovative packaging methods and managing supplier relationships, ideal for candidates with expertise in semiconductor and photonic packaging.
IC Resources
gloucester, United Kingdom
Other
Virtual job fairs
-
Yes
2
04.06.2025
19.07.2025
Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Virtual job fairs
Required skills for the Principal Packaging Engineer will include:
Please contact Rachel Anderson for further details.